Auxiliary pressurizing device for chip bonding
A pressurizing device and chip bonding technology, which is applied in microstructure devices, manufacturing microstructure devices, decorative arts, etc., can solve the problems of uneven stress, insufficient bonding strength, etc., and achieves low production cost and strong bond Combine strength and success rate, the effect of high success rate
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[0018] A chip bonding auxiliary pressure device of the present invention, such as figure 1 As shown, it includes a limit block 1, a chassis 2, a conical joint 3, a compression nut 5, a compression plate 6, a square positioning rod 7, a connecting rod 8, and a limit bolt 10.
[0019] The limit block 1 is fixed vertically to the chassis 2, and the positioning concave platform for fixing the microfluidic chip is processed on the chassis 2. The concave surface of the positioning concave platform is polished, and the surface of the substrate 4 and the cover sheet 12 to be bonded are activated and merged. Chips are put into the positioning concave platform of the chassis 2. The bottom surface of the pressing plate 6 is a plane, and the center of the upper surface is processed with a conical groove. The pressing plate 6 is pressed on the cover piece 12; a limiting groove is opened on the limiting block 1. , the limit groove is processed with a positioning through groove, the slotting...
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