Lifting device and semiconductor device processing equipment with same

Abstract

The invention provides a lifting device which is used for lifting so as to support a lifting needle of a device. The lifting device comprises a central guide rod, a mounting flange with a hollow structure, a hollow sleeve, a corrugated pipe and at least two central guide rod limiting parts with hollow structures, wherein the first limiting part is arranged in the hollow part of the mounting flange and the outer wall of the first limiting part is in tight fit with the inner wall of the mounting flange; the second limiting part is arranged at the lower region in the hollow sleeve and the outer wall of the second limiting part is in tight fit with the inner wall of the hollow sleeve; and the central guide rod penetrates through the first limiting part, the corrugated pipe and the second limiting part in the axial direction in sequence and is in tight fit with the inner walls of the first limiting part and the second limiting part. In addition, the invention provides semiconductor device processing equipment with the lifting device. Through the lifting device and the semiconductor device processing equipment provided by the invention, radial migration of the central guide rod can be reduced, product yield and production efficiency can be increased, reliable running of the system can be guaranteed, and cost is saved.

Description

Technical field [0001] The present invention relates to the field of semiconductor processing, in particular to the improvement of a lifting device for lifting needles and a semiconductor device processing equipment having the lifting device. Background technique [0002] As we all know, integrated circuits are manufactured from semiconductor devices such as semiconductor wafers through many processing / treatment processes. With the rapid development of electronic technology, people have higher and higher requirements for the integration of integrated circuits, which requires companies that produce integrated circuits to continuously improve the processing capabilities of semiconductor devices. The processing of semiconductor devices often needs to be performed in a reaction chamber. For example, in the manufacturing process of integrated circuits, it is often necessary to make extremely fine-sized patterns on the wafer in the reaction chamber. The most important way to form thes...

AI Technical Summary

Problems solved by technology

This cantilever beam structure makes it easy for the cylinder piston to transmit a lateral extrusion force when transmitting the driving force to the center guide rod, so that the center guide rod deviates from the axial centerline of the ideal movement, and causes the aforementioned many problems

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