Highly efficient heat radiation LED (Light Emitting Diode) lamp

Abstract

The invention provides a highly efficient heat radiation LED (Light Emitting Diode) lamp, which comprises a lamp bead and a heat conducting substrate. The highly efficient heat radiation LED lamp is characterized in that a conductive welding material layer, a copper foil layer, an insulating layer and a heat conducting plating layer are arranged between the lamp bead and the heat conducting substrate in turn. In the invention, an electrode pad of the lamp bead is connected to the copper foil layer by the conductive welding material layer; a heat conducting pad of the lamp bead is connected to the heat conducting plating layer by the conductive welding material layer; and the heat conducting performance is largely increased and the structural strength is stabilized by using a non-mechanical connecting mode. Furthermore, atoms between the plating layer and the heat radiation substrate can be exchanged actively by using a silver-tin composite plating layer so that the heat conducting effect can be obviously increased.

Description

technical field [0001] The present invention relates to an LED lamp, in particular to an efficient heat dissipation LED lamp capable of significantly improving heat dissipation performance. Background technique [0002] LED is a semiconductor that can convert electrical energy into visible light. It changes the principle of tungsten filament luminescence of incandescent lamps and the three-based toner luminescence of energy-saving lamps, and uses electric field luminescence. LED has the characteristics of long life, high luminous efficiency, no radiation and low power consumption. High-power LEDs generally have 0.5W, 1W, 3W, 5W, and there are also higher power ones, but with the increase of LED power, the heat dissipation also increases. Nowadays, most high-power LEDs are single-chip applications, and plus Great heatsink. [0003] The LED lamp beads in the prior art are usually mechanically connected and fixed to the radiator through the aluminum substrate, and the aluminu...

AI Technical Summary

Problems solved by technology

High-power LEDs generally have 0.5W, 1W, 3W, 5W, and there are also higher power ones, but with the increase of LED power, the heat dissipation also increases. Nowadays, most high-power LEDs are single-chip applications, and plus large heat sink

[0003] The LED lamp beads in the prior art are usually mechanically connected and fixed to the radiator through the aluminum substrate, and the aluminum substrate and the radiator are installed with a mechanical connector made of insulating material, but the aluminum substrate, the insulating connector, and the heat dissipation The coefficients of thermal expansion are different between devices, which easily leads to quality problems that cause reduced thermal conductivity or unstable structural strength

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