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Cyanogen-free gilding solution for electro-gilding

A cyanide-free gold plating and electroplating technology, which is applied in the field of electroplating gold technology, can solve the problems of coarse crystals, easy oxidation of sulfite, and high cost of plating solution, so as to reduce damage and benefit the environment.

Inactive Publication Date: 2011-08-24
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, compared with cyanide gold plating, there are the following disadvantages: ① sulfite is easily oxidized in the air, and the plating solution is unstable
② The physical properties of the coating are poor, and the crystallization is relatively coarse, so it is difficult to obtain a uniform and dense coating required by semiconductor packaging
③Poor coating wear resistance
④ Gold fulminate needs to be synthesized during solution preparation, and the cost of plating solution is high

Method used

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  • Cyanogen-free gilding solution for electro-gilding

Examples

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Embodiment

[0012] Take cyanide-free gold plating as an example: copper parts are nickel-plated with gold (Au 2μm).

[0013] Process flow:

[0014] chemical degreasing Wash 1 electrolytic degreasing Wash 2 pickling Wash 3 Wash 4 Electroplated Nickel Wash 5 activate Washed 6 pure water wash Cyanide-free gold plating Washed 7 pure water wash dry.

[0015] Except for the cyanide-free gold plating process, other processes and process conditions are the same as conventional electroplating, and the relevant formulas and parameters are as follows:

[0016] The chemical degreasing process conditions are as follows:

[0017] Sodium hydroxide 12g / L

[0018] Anhydrous Sodium Carbonate 25 / L

[0019] sodium phosphate 60 / L

[0020] Surfactant 1ml / L

[0021] Temperature 90°C

[0022] The time is 15 minutes.

[0023] Electrolytic degreasing process conditions are as follows:

[0024] So...

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Abstract

The invention relates to cyanogen-free gilding solution for electro-gilding and a preparation method. The cyanogen-free gilding solution consists of the following substances: 15 to 18 g / L of gold potassium citrate, and 100 L of Temperex9500 cylinder opening agent. The method comprises the following steps of: heating the cylinder opening agent to the temperature of 65 DEG C, adding the gold potassium citrate with stirring, and stirring till full dissolution to obtain plating solution; cooling the plating solution to the temperature of 25 DEG C, and measuring the pH value; when the pH value is more than 5.2, adding an acidic regulator for regulating; and when the pH value is less than 4.8, adding aqueous ammonia for regulating, and regulating the pH value to between 4.8 and 5.2 to obtain the cyanogen-free gilding solution. The cyanogen-free plating is realized, the operability of the process and the quality of a coating reach the cyanogen plating level, and the cyanogen-free gilding solution is favorable for environmental protection and lightens harm to operators.

Description

technical field [0001] The invention belongs to the field of electroplating gold technology, in particular to a cyanide-free plating solution for electroplating gold. Background technique [0002] Gold plating is widely used in the electronics industry due to its good electrical conductivity and corrosion resistance. However, the current gold plating process is still dominated by cyanide-containing electroplating. Due to the high toxicity of cyanide, it poses a threat to workers' health and environmental protection. In Order No. 32 issued by the former State Economic and Trade Commission on June 2, 2002, "cyanide-containing electroplating" was included in Item 23 of the "Catalogue for Eliminating Backward Production Capabilities, Processes and Products" (the third batch), and it was restricted to be eliminated by the end of 2003. On December 26, 2003, the National Development and Reform Commission announced the Guidance Catalog for Industrial Structure Adjustment (Draft for ...

Claims

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Application Information

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IPC IPC(8): C25D3/48
Inventor 胡江华邱颖霞卢海燕吴晓霞
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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