Process for producing ceramic mobile phone circuit board

Abstract

The invention discloses a process for producing a ceramic mobile phone circuit board, which sequentially comprises the steps of providing a ceramic base plate, drilling a conducting hole, electroplating the conducting hole, manufacturing an inner layer circuit, processing the hole wall of the conducting hole, filling liquid resin, flattening the conducting hole, carrying out high-temperature vacuum pressing on a multilayer circuit board, drilling an outer layer and manufacturing an outer layer circuit . Because a ceramic board is adopted as an inner layer of the multilayer circuit board, the ceramic mobile phone circuit board has novel structure and outstanding advantages; the liquid resin is combined with a semi-curing resin layer in the conducting hole together, thus the problem of layer and circuit separation caused by expansion and shrinkage inconformity of a ceramic material and resin is solved, the bonding force of materials is strengthened, expensive grinding equipment and grinding materials are saved, the production cost is lowered and the technical requirement on operators is reduced, simpler production process, and stable product performance, energy saving and environment protection are achieved and the productivity is improved.

Description

technical field [0001] The invention relates to a production process of a circuit board, in particular to a production process of a ceramic mobile phone circuit board. Background technique [0002] Existing circuit boards generally adopt resin and glass cloth as substrates, and circuit layers are respectively arranged on both sides thereof. With the continuous development of technology, the circuit board is getting smaller and smaller, and the electronic components are becoming more and more dense. The heat dissipation effect of the existing substrate is not ideal, and it cannot solve the heat dissipation problem caused by the dense electronic components. Therefore, people use ceramics as Substrate, ceramic heat dissipation effect is better. Compared with traditional printed circuit boards, ceramic circuit boards obviously have many advantages: excellent thermal conductivity, chemical corrosion resistance, excellent heat resistance, superior electrical properties such as di...

AI Technical Summary

Problems solved by technology

There are many disadvantages in this traditional process: after the resin is dried and solidified, the resin will expand, so it must be polished and leveled, but the grinding will cause material deformation, resulting in displacement of conductive points, resulting in open and short circuits; grinding will result in smooth and semi-cured surfaces. The resin has poor bonding force and is prone to detachment. The cured resin is hard and difficult to polish. Therefore, expensive equipment and expensive ceramic brushes must be used, which are expensive and consume a lot of power.

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