Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Microlithographic projection exposure apparatus

A technology of microlithography and equipment, which is applied in the field of illumination system and projection objective lens, and can solve the problems that heat dissipation cannot be guaranteed and components are damaged.

Active Publication Date: 2015-02-04
CARL ZEISS SMT GMBH
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The light absorbed by the mirrors heats them up, which can lead to destruction of the reflective layer system or other components of the mirror unit if heat dissipation cannot be ensured

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microlithographic projection exposure apparatus
  • Microlithographic projection exposure apparatus
  • Microlithographic projection exposure apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0083] figure 1 A perspective view showing a detail of a mirror unit 10 included in an illumination system of a projection exposure apparatus for microlithography. The details shown reveal a base plate 12, and a mirror unit with a mirror 14 held on a T-shaped support 16 and two sets of leaf springs 18 connected to the support 16 and the base The plate 12 is also composed of a material with high thermal conductivity such as steel, silicon, silicon carbide, copper, silver or gold. The leaf spring 18 together with the support body 16 forms a solid joint for the mirror 14 .

[0084] The mirror unit also has two magnetic coils 22 arranged between the leaf spring 18 and the longer branch of the support body 16 . Of course, other drives can also be used instead of magnetic coils. The mirror unit includes figure 1 A plurality of mirror units are shown, for example hundreds or even thousands, arranged on a common base plate 12 . The base plate 12 can also be curved, so that the mi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A microlithographic projection exposure apparatus has a mirror array having a base body and a plurality of mirror units. Each mirror unit includes a mirror and a solid-state articulation, which has at least one articulation part that connects the mirror to the base body. A control device makes it possible to modify the alignment of the respective mirror relative to the base body. Mutually opposing surfaces of the mirror and of the base body, or of a mirror support body connected to it, are designed as corresponding glide surfaces of a sliding bearing.

Description

technical field [0001] The present invention relates to a microlithographic projection exposure apparatus, in particular to an illumination system and a projection objective of such an arrangement having a mirror array with a substrate and a plurality of mirrors arranged on the substrate and the plurality of reflectors The mirrors can be tilted or otherwise altered in their arrangement relative to the substrate. Background technique [0002] Integrated circuits and other microstructured elements are typically fabricated by applying multiple structural layers to a suitable substrate, which may be a silicon wafer, for example. To structure these layers, they are first covered with a photoresist that is sensitive to light of a specific wavelength range, for example, light in the deep ultraviolet (DUV) or extreme ultraviolet (EUV) spectral range. Currently, conventional light wavelengths for DUV systems are 248nm, 193nm, and sometimes 157nm; EUV projection exposure equipment cu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G02B26/08
CPCG02B7/1827G03F7/70891G02B26/0833G03F7/70116G03F7/702G03F7/70291G02B17/002G02B15/00G03F7/20H01L21/027
Inventor 萨沙·布莱迪斯特尔关彦彬弗洛里安·巴赫丹尼尔·本兹塞韦林·沃尔迪斯阿明·沃伯
Owner CARL ZEISS SMT GMBH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com