Composite ceramic polishing chip and preparation method thereof

Abstract

The invention discloses a composite ceramic polishing chip and a preparation method thereof. The composite ceramic polishing chip is prepared by the following steps of: adding water into 2 to 4 weight parts of raw material and 6 to 8 weight parts of binding agent, mixing and stirring uniformly, mixing, performing extrusion molding and sintering, wherein the raw material is the mixture which comprises 85 to 95 percent of aluminum oxide and 5 to 15 percent of zirconium oxide base stock, and the bonding agent is the mixture which comprises 55 to 65 percent of kaolin and 35 to 45 percent of potash feldspar, and the zirconium oxide base stock is the mixture which comprises 97 to 99 percent of zirconium oxide and 1 to 3 percent of yttrium oxide. In the method, nano powder raw materials are bonded by using the bonding agent to form a spherical polishing chip. A chip electronic material is polished by using the polishing chip instead of the conventional powder abrasive material. The method is easy to operate, chemical aids are not needed to be added and pollution to the environment is small. The used equipment has low manufacturing cost, not only can perform one-side or double-side polishing processing, but also can perform omnibearing polishing, and can improve the polishing effect and stabilizing the polishing quality. The formula of the polishing chip is reasonable, and the polishing chip has high abrasive resistance, toughness and strength. After being sintered, the grains are refined and the grinding quality of workpieces is improved.

Description

technical field [0001] The invention relates to a polishing material used in the grinding industry and a preparation method thereof, in particular to a composite ceramic polishing block and a preparation method thereof, belonging to the technical field of grinding materials. Background technique [0002] At present, the polishing of chip electronic materials (including various types of ceramic substrates, fully printed electronic circuit boards, various chips, ceramic capacitor substrates and other sheet materials) is basically done by traditional powder polishing technology. There are problems such as low processing efficiency, small processing output, inability to produce continuously, and inability to form automatic assembly line operations, and only one-sided or double-sided polishing can be performed on the workpiece, and it cannot be polished in all directions, so the polishing effect of the traditional method is not ideal. , The polishing quality is unstable. If a si...

AI Technical Summary

Problems solved by technology

[0002] At present, the polishing of chip electronic materials (including various types of ceramic substrates, fully printed electronic circuit boards, various chips, ceramic capacitor substrates and other sheet materials) is basically done by traditional powder polishing technology. There are problems such as low processing efficiency, small processing output, inability to produce continuously, and inability to form automatic assembly line operations, and only one-sided or double-sided polishing can be performed on the workpiece, and it cannot be polished in all directions, so the polishing effect of the traditional method is not ideal. , Unstable polishing quality

If one-sided or double-sided grinding and polishing machine equipment is used to polish chip electronic materials, the equipment is expensive, the operation is difficult, the shape, particle size and material of the abrasive are extremely demanding, and a large amount of chemical additives is required, which will pollute the environment. bigger

[0003] The above problems are technical problems that have plagued the polishing of chip electronic materials for a long time, and have not been effectively solved for a long time