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Mold for forming optical component, optical component thereof and manufacturing method of the optical component

A technology for optical components and manufacturing methods, applied in the directions of optical components, optics, manufacturing tools, etc., can solve the problems of incapable of thinning film thickness, durability, insufficient mold release, welding, etc., to reduce friction coefficient, reactivity, etc. low effect

Active Publication Date: 2011-09-21
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of a film that requires a cushioning action or a lubricating action, if the thickness of the film is reduced, the effect will be reduced, so there is a problem that the thickness of the film cannot be reduced and sufficient adhesion cannot be obtained.
[0011] In addition, in these prior art molds for optical element molding, materials containing high reactivity (such as TiO 2 , Nb 2 o 5 、WO 3 、Bi 2 o 3 etc.) glass, there is a problem of welding during molding, or a problem of cracking (cracking) when molding a thin lens, etc., and the durability and releasability will be insufficient.
In addition, there is not yet a mold that has sufficient durability and releasability, and has good adhesion between the base material and the surface layer of the mold for molding an optical element.

Method used

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  • Mold for forming optical component, optical component thereof and manufacturing method of the optical component
  • Mold for forming optical component, optical component thereof and manufacturing method of the optical component
  • Mold for forming optical component, optical component thereof and manufacturing method of the optical component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0107]

[0108] Cemented carbide (WC-Co) was used as the base material of the optical element molding die.

[0109] As the upper mold base of the mold for molding an optical element, a base having a flat surface is used.

[0110] As the base material of the lower mold of the mold for molding an optical element, a base material having a concave surface is used.

[0111] -Formation of surface layer-

[0112] A surface layer of Si-containing diamond-like carbon having a thickness of 10 nm was formed on the surfaces (pressed surfaces) of the upper mold base and the lower mold base described above by plasma CVD under the following conditions. The content of Si in the above-mentioned surface layer is calculated with methane (CH 4 ) gas flow rate (5sccm~200sccm) and tetramethylsilane (TMS) gas flow rate (0.1sccm~5sccm) were adjusted.

[0113] Conditions for plasma CVD:

[0114] High frequency power supply…13.56MHz

[0115] High frequency output...2kW

[0116] Gas pressure…4Pa...

Embodiment 1-2

[0127]

[0128] As the base material of the optical element molding die, the same base material as in Example 1-1 was used.

[0129] -Formation of surface layer-

[0130] A surface layer of Si-containing diamond-like carbon having a thickness of 10 nm was formed on the surfaces (pressed surfaces) of the upper mold base and the lower mold base described above by plasma CVD under the following conditions. The content of Si in the above-mentioned surface layer is calculated with methane (CH 4 ) gas flow rate (5sccm~200sccm) and tetramethylsilane (TMS) gas flow rate (0.1sccm~5sccm) were adjusted.

[0131] Conditions for plasma CVD:

[0132] High frequency power supply…13.56MHz

[0133] High frequency output...2kW

[0134] Gas pressure…4Pa

[0135] Methane (CH 4 ) Gas flow...Adjust to 5 sccm ~ 200 sccm.

[0136] The tetramethylsilane (TMS) gas flow rate... was adjusted to 0.1 sccm to 5 sccm.

[0137] As in Example 1-1, analysis by Raman spectrometry revealed that diamond-...

Embodiment 1-3

[0142]

[0143] In Example 1-1, except having changed the set 2 kW into 1.5 kW about the high-frequency output of plasma CVD, it carried out similarly to Example 1-1, and manufactured the mold 3 for optical element molding.

[0144] As a result of analysis by Raman spectrometry in the same manner as in Example 1-1, diamond-like carbon was formed on the surface layer of the mold 3 for molding an optical element.

[0145] The contents of Si and C in the surface layer were confirmed by XPS analysis in the same manner as in Example 1-1, and it was found that Si / C=0.01.

[0146] When the coefficient of friction of the surface layer was measured in the same manner as in Example 1-1, it was 0.08.

[0147] The surface energy of the above-mentioned surface layer was measured in the same manner as in Example 1-1, and the result was 41mJ / m 2 .

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Abstract

The present invention provides a mold for forming an optical component, an optical component and a manufacturing method of the optical component. The mold for forming the optical component is characterized in that: the mold is provided with a substrate and a surface layer; the surface layer contains Si-containing diamond-shaped carbon; the ratio (Si / C) between the content of Si in the surface layer and C is 0.01-0.05; and the thickness of the surface layer is above 2 nm and below 50 nm.

Description

technical field [0001] The present invention relates to a mold for molding an optical element, a method for manufacturing an optical element using the mold for molding an optical element, and an optical element obtained by the manufacturing method. Background technique [0002] As a method of manufacturing an optical glass lens as an optical element, a direct press molding method is known. The direct stamping method is to heat a block of glass as an optical element material on a mold for forming an optical element that is processed into a required surface quality and surface accuracy, or to heat a block of glass that has been preheated. A method of stamping and forming an object to manufacture an optical glass lens. [0003] In the optical element molding mold used in the above-mentioned direct stamping method, in order to prevent cracks (cracks) from occurring on the optical element, from the viewpoint of durability, mold release, etc., it is also required to have low reac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B11/06C03B11/08C03B11/00G02B3/00
CPCC03B11/086
Inventor 中村幸则柏谷诚
Owner FUJIFILM CORP