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Vibrating piece substrate and tuning-fork vibrating piece

A technology of vibrating plate and tuning fork type, which is applied in the field of vibrating plate base plate and tuning fork type vibrating plate, and can solve the problems of reducing the production number of tuning fork type vibrating plate and occupying space of the measuring disc, etc.

Inactive Publication Date: 2011-09-21
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, when the measuring disc is installed on the frame near the base, since the measuring disc takes up space, there is a problem that the production number of tuning-fork type vibrating reeds per vibrating reed substrate decreases.

Method used

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  • Vibrating piece substrate and tuning-fork vibrating piece
  • Vibrating piece substrate and tuning-fork vibrating piece
  • Vibrating piece substrate and tuning-fork vibrating piece

Examples

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Embodiment Construction

[0051] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0052] figure 1 It is a diagram showing a part of one surface (hereinafter referred to as “front surface”) of the vibrating element substrate 11 according to the embodiment of the present invention. The vibrating piece substrate 11 is a plate-shaped substrate having two surfaces facing in opposite directions, and is made of a piezoelectric material such as quartz. A plurality of tuning-fork type vibrating elements 12 are formed on the vibrating element substrate 11 by processing both surfaces of the vibrating element substrate 11 in a predetermined shape pattern. As shown in the figure, the vibrating piece substrate 11 has a frame portion 13 and a plurality of tuning fork type vibrating pieces 12, and also has a plurality of connecting portions 14a, 14b for connecting the frame portion 13 and the plurality of tuning fork type vibrating pieces 12, respectively...

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PUM

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Abstract

The invention provides a vibrating piece substrate and a tuning-fork vibrating piece for providing the following vibration piece substrate, tuning-fork vibrating pieces and packages, wherein when measurement pads are provided in the vibrating piece substrate to measure the characteristics of a plurality of tuning-fork vibrating pieces formed in the vibrating piece substrate, the measurement pads are arranged so as to increase the number of tuning-fork vibrating pieces per vibrating piece substrate. Support arm portions extend in the same direction as the direction in which the vibration arm portions extend, and the support arm portions have a length smaller than the vibration arm portions, the tuning-fork vibrating pieces are arranged such that the vibration arm portions of adjacent tuning-fork vibrating pieces sandwich the region of a portion of the frame portion therebetween, measurement pads are formed in the region of the frame portion sandwiched between the vibration arm portions, and wiring lines are formed in the linking portions to provide electric conduction between the tuning-fork vibrating pieces and the measurement pads.

Description

technical field [0001] The present invention relates to a vibrating element substrate and a tuning fork type vibrating element, and more particularly to a vibrating element substrate and a tuning fork type vibrating element provided with a measuring pad (measurement PAD) for characteristic measurement. Background technique [0002] Conventionally, various vibrators have been used as clock signal sources in electronic equipment. Among the vibrating reeds, a tuning-fork type vibrating reed that is easy to manufacture and has good frequency-temperature characteristics is often used. As a method of manufacturing a tuning fork vibrating piece, a substrate (wafer) made of a piezoelectric material such as quartz is etched into a shape in which the bases of a plurality of tuning fork vibrating pieces are connected to a frame, and then the bases of each tuning fork vibrating piece are removed from the The frame is broken (for example, refer to Patent Document 1). [0003] However, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/19H03H9/21H01L41/09H01L41/18H01L41/22H01L41/29H01L41/332H01L41/335H03H3/02H03H9/215
CPCH03H9/215H03H9/21G01C19/5607H03H3/02H03H9/19
Inventor 山田祥之
Owner SEIKO EPSON CORP