Manufacturing process of electrode surface protective layer of multilayer piezoelectric element
A piezoelectric element and electrode surface technology, applied in the direction of electrical components, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve the problems of reducing product yield, component damage, affecting product quality, etc., to achieve guaranteed The effect of low yield, low bending rigidity, and small added mass
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[0018] refer to figure 1 , a typical fabrication process flow diagram of a multilayer piezoelectric element, which includes the following steps:
[0019] 1. Making ceramic green sheets: making ceramic green sheets by casting or other processes;
[0020] 2. Overprinting: printing electrode paste on the surface of the ceramic green sheet to form an electrode layer, and superimposing the ceramic green sheet with the printed electrode layer layer by layer to form a multi-layer structure;
[0021] 3. Densification of green sheets: Under certain temperature and pressure conditions, the multi-layer green sheets are integrated into one, which is the densification of green sheets;
[0022] 4. Electrode connection: The interlayer electrode connection is completed by various known methods. In this step, the internal electrode connection can be performed after the slicing is completed, or the internal electrode connection can be performed after sintering;
[0023] 5. Printing or coating...
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