Device and method for preparing egg-type alloy welded ball

A technology for preparing devices and alloys, used in welding equipment, metal processing equipment, welding media, etc., can solve the problems of lack of cooling environment and affecting egg structure.

Inactive Publication Date: 2011-10-12
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The injection technology proposed by the Massachusetts Institute of Technology (MIT) and Passow in the United States lacks a good cooling environment, and the Marangoni movement requires a large temperature gradient, thus

Method used

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  • Device and method for preparing egg-type alloy welded ball
  • Device and method for preparing egg-type alloy welded ball
  • Device and method for preparing egg-type alloy welded ball

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Experimental program
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Embodiment Construction

[0035] The technical solutions of the present invention will be further described below in conjunction with specific embodiments.

[0036] to attach image 3 As shown, the preparation device of the present invention includes a melting vessel (such as a crucible 1), a piezoelectric oscillator 2, an electrode plate 6, a spiral cooling device 10, a liquid nitrogen storage device 38, a liquid nitrogen recovery device 39, a collector 11, The vacuum chamber 12 is provided with a piezoelectric oscillator 2 on the crucible 1. The piezoelectric oscillator 2 is connected to the signal generator 36 through a control line. The bottom of the crucible 1 is inlaid with a micro nozzle 5. The vibration of the piezoelectric oscillator 2 The head 3 is arranged on the upper part of the microhole 5, the outer wall of the crucible 1 has a heater 4, and the bottom of the crucible 1 has an electrode plate 6, and an opening 7 is arranged in the middle of the electrode plate 6 opposite to the nozzle. ...

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Abstract

The invention discloses a device for preparing an egg-type composite alloy welded ball and a preparation method thereof. The traditional uniform drop jetting device is utilized, a cylindrical internal screw liquid nitrogen circulating cooling device is added, a spiral pipe is filled with flowing liquid nitrogen, and the temperature in the cooling device can be maintained to be within an appropriate range. When a high temperature drop-state alloy metal welded ball enters into a spiral-type cooling device, and heat transfer is carried out between exterior of the drop-state alloy metal welded ball and air in a cavity, thus a temperature gradient is formed between the inner core and the shell of the welded ball, and the temperature gradient causes the welded ball to form a layered egg-type structure. By utilizing the technical scheme in the invention, the drop-state alloy metal welded ball can form a layered structure that the center is a Cu core and the exterior is Sn-Bi alloy in a falling process, thus a core-shell structure can be rapidly formed and the welded ball with better comprehensive properties can be obtained.

Description

technical field [0001] The invention relates to a preparation technology of alloy metal powder, in particular to a preparation device and a preparation method of composite alloy solder balls. Background technique [0002] Now in the electronics industry, ball grid array packaging (BGA packaging) has gradually become the mainstream of electronic packaging technology. This technology uses alloy solder balls instead of previous pins to meet the circuit interconnection and mechanical interconnection requirements between electronic components. The core technology of the electronic packaging method is the preparation of high-quality alloy solder balls. The preparation methods of alloy metal powder can be roughly divided into two categories: physical chemical method and mechanical method. Among them, the mechanical method is mainly mechanical pulverization method and direct physical and chemical method of metal melt, including mechanical grinding, cold air current pulverization, ce...

Claims

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Application Information

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IPC IPC(8): B01J2/06B22F9/06B23K35/14
Inventor 吴萍周伟穆文凯李宝凌陆遥吕顺鹏张一平
Owner TIANJIN UNIV
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