Semiconductor package substrates
一种封装基板、半导体的技术，应用在半导体器件、半导体/固态器件制造、半导体/固态器件零部件等方向，能够解决危害使用者安全、降低效率、热能无法转换光能等问题，达到增加散热性的效果
Active Publication Date: 2014-05-14
TAIWAN SEMICON MFG CO LTD
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Problems solved by technology
However, the heat energy generated when the electrical energy passes through the PN junction of the LED cannot be converted into the required light energy
If the heat energy cannot be removed, operating the LED at high temperature will not only reduce its efficiency, but also reduce the reliability of the LED, and even endanger the safety of users
Method used
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[0019] It is to be understood that the following description provides various embodiments or examples to illustrate various features of the invention. In order to simplify the description, specific embodiments, units, and combinations will be used for description. However, these specific examples are only used to illustrate rather than limit the present invention. In addition, in order to simplify the description, the present invention uses the same reference numerals to indicate similar components in different embodiments in different drawings, but the above repeated reference numerals do not mean that the components in different embodiments have the same corresponding relationship.
[0020] Figure 1A-Figure 18 It is a cross-sectional view of the intermediate process of some embodiments of the present invention. Such as Figure 1A As shown, some embodiments have a photoresist pattern on the first substrate 100 . The first substrate 100 may be a silicon base, a doped or u...
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Abstract
The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.
Description
technical field [0001] The present invention relates to a semiconductor packaging substrate, and more particularly to the configuration, arrangement, and shape of through-silicon plugs. Background technique [0002] Reduction in size and improvement in electrical performance are trends in advanced semiconductor packaging, allowing industry and consumers to use faster, cheaper, and smaller products. Through through-silicon vias (TSVs) or more precisely, through-silicon plugs (TSPs), the integration level of advanced semiconductor packages can be improved and the overall size can be reduced. As the name suggests, the electrical connection of the front and back sides of the semiconductor device can vertically assemble multiple chips in the package, instead of the known single chip. In this way, more and more semiconductor components can be integrated into smaller and smaller dimensions. In addition, different types of semiconductor chips can also be integrated into a single p...
Claims
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IPC IPC(8): H01L23/13H01L23/367H01L33/64
CPCH01L2924/04941H01L2224/32506H01L24/29H01L2224/73265H01L2221/68359H01L33/641H01L2224/32225H01L23/147H01L2224/97H01L2224/48091H01L21/6835H01L2924/01078H01L2924/19041H01L24/48H01L2924/01079H01L21/76877H01L2221/68345H01L2924/12041H01L21/486H01L33/62H01L2924/01322H01L33/486H01L24/49H01L2924/01029H01L24/97H01L2224/49113H01L2924/01019H01L2224/48227H01L23/481H01L2224/48233H01L23/49827H01L2924/14H01L2924/181H01L2924/00014H01L2924/3512H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L23/34H01L23/12H01L21/76843H01L2224/16H01L33/644H01L33/647H01L33/005H01L2933/0066H01L21/3065H01L21/76876H01L21/76879H01L21/76898H01L33/0054
Inventor 余振华张宏宾林咏淇余佳霖洪瑞斌黄见翎
Owner TAIWAN SEMICON MFG CO LTD