Etching cleaning equipment and etching cleaning technology

Abstract

The invention relates to etching cleaning equipment and an etching cleaning technology in the photovoltaic industry. The etching cleaning equipment is provided with three chemicals slots, three DI-water rinsing baths and an air drying cabin, wherein the three chemicals slots are taken as a hydrofluoric acid / nitric acid etching slot, a potassium hydroxide etching slot and a hydrofluoric acid / hydrochloric acid etching slot respectively. The etching cleaning equipment and the etching cleaning technology can be used to solve the obvious defect problems of chippings and dark spots.

Description

technical field [0001] The invention relates to a silicon chip etching and cleaning process and equipment in the photovoltaic industry. Background technique [0002] figure 1 It is the original process flow chart of the texturing equipment. The wafer passes through each tank in turn according to the direction indicated in the figure, and finally is dried by the air knife in the air-drying tank, and the whole process ends. The black arrow shows the schematic diagram of the peripheral pure water in the device. It first enters the tank of RINSE3, overflows into RINSE2 after it is full, and flows into RINSE1 in the same way. And it is unstable, so when it comes to the dryer, it is difficult for the air knife to completely dry the film, resulting in tiny water droplets on the surface of some films, resulting in blue and black spots on the surface of some films after diffusion; due to the difficulty of drying, the air knife has to be moved The frequency is increased to 90%, the ...

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Problems solved by technology

[0003] In order to overcome the above defects, the technical problem to be solved in the present invention is to provide a method for testing the VA content in EVA for existing obvious defects.

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