Preparation method of sub-micron-sized two-dimensional dielectric cylindrical photonic crystal
A photonic crystal, sub-micron technology, applied in microlithography exposure equipment, crystal growth, chemical instruments and methods, etc., can solve the problems of difficult to obtain columnar structure, development rate difference, difficult columnar structure, etc., and achieve good application. Prospect, low price, simple operation effect
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[0039] (1) Cleaning the substrate: The InP substrate was ultrasonically cleaned three times with carbon tetrachloride, acetone, and ethanol in sequence, then rinsed with deionized water, dried with nitrogen, and finally baked in an oven.
[0040] (2) PECVD deposited Si 3 N 4 : Put the baked InP substrate into the PD-I plasma deposition table to deposit Si 3 N 4 , deposition thickness of 100nm.
[0041] (3) Spin-coating photoresist: The photoresist used is composed of S6809 brand photoresist (US SHIPLEY company) and E2 brand thinner (US SHIPLEY company) (the main components are all ethyl lactate) in volume ratio 1:2, spin-coated for 30s at a rotational speed of 6000rad / min, to obtain a photoresist thickness of 120nm.
[0042] (4) Soft baking: put the spin-coated photoresist sample on a hot plate at 100°C for baking.
[0043] (5) Vertical cross exposure: Rotate the rotating bracket so that the angle between the light beam and the high-reflection flat mirror on the rotating ...
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