Semiconductor thermoelectric power generation component

Abstract

The invention relates to a semiconductor thermoelectric power generation component, which comprises a hot-end substrate, a cold-end substrate and a plurality of pairs of PN junction power generation particles, wherein every two adjacent pairs of PN junction power generation particles are connected in series by the inner sides of copper flow deflectors; and the hot-end substrate and the cold-end substrate are positioned at the two ends of the power generation particles respectively. The semiconductor thermoelectric power generation component is characterized in that: the hot-end substrate is an aluminum oxide ceramic substrate which is connected with the outer side of the copper flow deflector at a hot end; and the cold-end substrate is an aluminum alloy substrate which is connected with the outer side of the copper flow deflector at a cold end by using a high-thermal conductivity insulating double faced adhesive tape. In the semiconductor thermoelectric power generation component, thecold-end substrate is improved on the basis of the conventional commercial thermoelectric power generation component, and the film-laminated aluminum alloy substrate with a relatively higher thermal conduction coefficient replaces a conventional aluminum sesquioxide (Al2O3) ceramic substrate. The power generation component has the relatively higher thermal conduction efficient and relatively higher insulating properties, and improves the power generation performance of the thermoelectric power generation component. A method is simple and practical, and industrialization is easy to realize.

Description

technical field [0001] The invention relates to the technical field of semiconductor thermoelectric power generation, in particular to a high-efficiency thermoelectric power generation component that can be used for low-grade heat utilization. Background technique [0002] With the deepening of building a "resource-saving" and "environment-friendly" society, energy conservation and environmental protection have become a common problem faced by human beings in the 21st century. China is in a critical stage of sustainable development, and it is of great significance to fully recycle low-grade energy, waste heat, and waste heat energy. Our country is very short of energy, the utilization rate of energy is low, all kinds of industrial waste heat, waste heat and other low-grade thermal energy have not been effectively utilized, and there is an urgent need to develop new energy utilization technologies to save energy and improve energy utilization efficiency. [0003] Semiconduct...

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a semiconductor thermoelectric power generation component, which solves the problems of contact thermal resistance and cold end cooling between thermoelectric power generation components

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