Sputtering apparatus

Abstract

The invention relates to a sputtering apparatus comprising a chamber and a chamber port. A work bench is arranged in the center of the chamber. The chamber port is arranged on the chamber for opening or closing the chamber. Two first magnetic elements are arranged on one side of the chamber port oriented towards the work bench, and a second magnetic element is arranged on an inner wall of the chamber. The two first magnetic elements and the second magnetic element are arranged around the work bench. First target seats are respectively arranged on the sides of the first magnetic elements oriented towards the work bench, and a second target seat is arranged on one side of the second magnetic element oriented towards the work bench. A first included angle is formed between lines from first magnetic elements to the center of the work bench. A second included angle is formed between a line from the second magnetic element to the center of the work bench and a line from a neighboring first magnetic element to the center of the work bench. The second included angle is not equal to the first included angle.

Description

technical field [0001] The invention relates to a sputtering device, in particular to an unbalanced magnetron sputtering device. Background technique [0002] With the popularization and application of various electronic products, the requirements of consumers are getting higher and higher. In addition to satisfying the requirements for use functions, consumers also have new requirements for the appearance and touch texture of electronic products. For example, the shell of the product is required to have brilliant colors, metal texture, and wear resistance. [0003] Using the reactive magnetron sputtering coating method to coat the shell of the product can make the electronic product obtain a multi-layer film shell with various colors and high metal texture, which meets the needs of current consumers. [0004] However, with the continuous change of appearance, the geometric shape of the product becomes more and more complex, which makes the difficulty of coating also increa...

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Problems solved by technology

[0004] However, with the continuous change of appearance, the geometric shape of the product becomes more and more complex, which makes the difficulty of coating also increases

When using a traditional magnetron sputtering device for coating processing, because there are more cathode dark areas (higher positive charge concentration) in the area close to the cathode in the traditional magnetron sputtering device, the ion density and ionization degree are low. It is not conducive to improving the utilization rate of secondary electrons, that is, it is not conducive to the use of secondary electrons to collide with gas molecules to generate new electrons and ions

As a result, it not only affects the maintenance of ion concentration in the plasma region, it is not easy to make the glow discharge continue continuously, but also it is not conducive to increasing the angle range of the target atoms generated by sputtering to hit the coating element by using secondary electrons, so that the coating element Parts with complex shapes, especially the rear parts of some protrusions, are prone to insufficient coating, affecting the coating quality of coating components, resulting in an increase in product defect rate

At the same time, the lower ion density and ionization degree also easily affect the formation speed of the coating film and the compactness of the film layer.

In addition, for the coating components that need to be coated with different colors, the traditional sputtering device needs to coat one color first, and then replace a different target material. Therefore, the target material is easily contaminated during the replacement process, which affects the coating. the quality of

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