A kind of high temperature resistant epoxy resin composition for rapid pultrusion
A technology of epoxy resin and composition, which is applied in the field of preparation of the composition, can solve problems such as high viscosity and poor toughness, achieve the effects of improving processability and flexibility, highlighting heat resistance, and reducing shrinkage
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Embodiment 1
[0027] 16.0g of bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value 0.48-0.54), 24.0g of glycidylamine epoxy resin Mix JEh-012 (purchased from Changshu Jiafa Chemical Co., Ltd., epoxy value 0.80-0.85), heat to 100°C and stir until a transparent solution is formed, then cool to 50°C, and then add 10.5g to the transparent solution A mixture of dimethyldiaminodicyclohexylmethane (DMDC) and 4.0g 4,4'-diaminodiphenylsulfone (DDS), then add 0.2g boron trifluoride ethylamine, 1.0g propylene oxide and 2.0g of kaolin, mixed evenly, placed in a vacuum drying oven to remove remaining air bubbles, and then poured and solidified. The reaction exothermic curve of the epoxy resin system was tested by differential scanning calorimetry (DSC method). The heating rate was 5°C / min and 15°C / min. The gel temperature was 105°C and the curing temperature was 130°C by extrapolation. , the post-curing treatment temper...
Embodiment 2
[0029]12.0g of bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value 0.48-0.54), 28.0g of glycidylamine epoxy resin Mix JEh-012 (purchased from Changshu Jiafa Chemical Co., Ltd., epoxy value 0.80-0.85), heat to 100°C and stir until a transparent solution is formed, then cool to 50°C, and then add 9.0g of A mixture of m-phenylenediamine (m-PDA) and 3.9g 4,4'-diaminodiphenyl sulfone (DDM), followed by adding 0.2g diphenol, 1.0g ethylene glycol diglycidyl ether and 0.6g bentonite , mixed evenly, placed in a vacuum drying oven to remove the remaining air bubbles, and then poured and solidified. The reaction exothermic curve of the epoxy resin system was tested by differential scanning calorimetry (DSC method). The heating rate was 5°C / min and 15°C / min. The gel temperature was 90°C and the curing temperature was 130°C by extrapolation. , the post-curing treatment temperature is 195°C, ΔT=40°C. The ...
Embodiment 3
[0031] 32.0g of bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value 0.48-0.54), 8.0g of glycidylamine epoxy resin Mix JEh-010D (purchased from Changshu Jiafa Chemical Co., Ltd., epoxy value is 0.80-0.85), heat to 100°C and stir until a transparent solution is formed, then cool to 50°C, and then add 10.2g to the transparent solution A mixture of diethyltoluenediamine (DETDA) and 3.3g 4,4'-diaminodiphenylsulfone (DDS), followed by adding 2.0g 2-ethyl 4-methylimidazole, 2.0g propylene oxide, 1.6g of kaolin and 0.4g of nano-titanium oxide were mixed evenly, placed in a vacuum drying oven to remove remaining air bubbles, and then poured and solidified. The reaction exothermic curve of the epoxy resin system was tested by differential scanning calorimetry (DSC method). The heating rate was 5°C / min and 15°C / min. The gel temperature was 86°C and the curing temperature was 132°C by extrapolation. , th...
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