A kind of high temperature resistant epoxy resin composition for rapid pultrusion

A technology of epoxy resin and composition, which is applied in the field of preparation of the composition, can solve problems such as high viscosity and poor toughness, achieve the effects of improving processability and flexibility, highlighting heat resistance, and reducing shrinkage

Inactive Publication Date: 2011-12-21
BLUESTAR BEIJING CHEM MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy resins currently used in the pultrusion process generally have high viscosity or poor heat resistance and toughness. Therefore, the

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 16.0g of bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value 0.48-0.54), 24.0g of glycidylamine epoxy resin Mix JEh-012 (purchased from Changshu Jiafa Chemical Co., Ltd., epoxy value 0.80-0.85), heat to 100°C and stir until a transparent solution is formed, then cool to 50°C, and then add 10.5g to the transparent solution A mixture of dimethyldiaminodicyclohexylmethane (DMDC) and 4.0g 4,4'-diaminodiphenylsulfone (DDS), then add 0.2g boron trifluoride ethylamine, 1.0g propylene oxide and 2.0g of kaolin, mixed evenly, placed in a vacuum drying oven to remove remaining air bubbles, and then poured and solidified. The reaction exothermic curve of the epoxy resin system was tested by differential scanning calorimetry (DSC method). The heating rate was 5°C / min and 15°C / min. The gel temperature was 105°C and the curing temperature was 130°C by extrapolation. , the post-curing treatment temper...

Embodiment 2

[0029]12.0g of bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value 0.48-0.54), 28.0g of glycidylamine epoxy resin Mix JEh-012 (purchased from Changshu Jiafa Chemical Co., Ltd., epoxy value 0.80-0.85), heat to 100°C and stir until a transparent solution is formed, then cool to 50°C, and then add 9.0g of A mixture of m-phenylenediamine (m-PDA) and 3.9g 4,4'-diaminodiphenyl sulfone (DDM), followed by adding 0.2g diphenol, 1.0g ethylene glycol diglycidyl ether and 0.6g bentonite , mixed evenly, placed in a vacuum drying oven to remove the remaining air bubbles, and then poured and solidified. The reaction exothermic curve of the epoxy resin system was tested by differential scanning calorimetry (DSC method). The heating rate was 5°C / min and 15°C / min. The gel temperature was 90°C and the curing temperature was 130°C by extrapolation. , the post-curing treatment temperature is 195°C, ΔT=40°C. The ...

Embodiment 3

[0031] 32.0g of bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value 0.48-0.54), 8.0g of glycidylamine epoxy resin Mix JEh-010D (purchased from Changshu Jiafa Chemical Co., Ltd., epoxy value is 0.80-0.85), heat to 100°C and stir until a transparent solution is formed, then cool to 50°C, and then add 10.2g to the transparent solution A mixture of diethyltoluenediamine (DETDA) and 3.3g 4,4'-diaminodiphenylsulfone (DDS), followed by adding 2.0g 2-ethyl 4-methylimidazole, 2.0g propylene oxide, 1.6g of kaolin and 0.4g of nano-titanium oxide were mixed evenly, placed in a vacuum drying oven to remove remaining air bubbles, and then poured and solidified. The reaction exothermic curve of the epoxy resin system was tested by differential scanning calorimetry (DSC method). The heating rate was 5°C / min and 15°C / min. The gel temperature was 86°C and the curing temperature was 132°C by extrapolation. , th...

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Abstract

The invention relates to a high temperature resistant epoxy resin composition for rapid pultrusion and a preparation method thereof. The epoxy resin composition consists of 100 parts by mass of epoxy resin, 30-50 parts by mass of amine curing agent, 0.5-5.0 parts by mass of latent curing agent, 0.5-5.0 parts by mass of small epoxy group It is composed of molecular compound and 0.5-5.0 parts by mass of inorganic filler. The mixed epoxy resin of glycidyl ether epoxy resin and glycidyl amine resin or glycidyl ester epoxy resin is used as the resin matrix of the pultruded product, so that the pultruded product has high strength and high toughness impact resistance, and has Excellent high temperature resistance. Using a latent curing agent together with a mixed amine curing agent can make the pultruded product have a lower curing temperature and be cured quickly within a certain period of time, shortening the curing time, thereby improving the pultrusion speed and production efficiency.

Description

technical field [0001] The invention relates to an epoxy resin composition, especially an epoxy resin composition which has good heat resistance and meets the requirements of a pultrusion molding process, and also relates to a preparation method of the composition. Background technique [0002] Epoxy resin is a class of important thermosetting resins that includes many types. Because of its good heat resistance, mechanical properties and manufacturability, it has been widely used in many fields. It is currently the most commonly used carbon fiber composite material. One of the base resins. [0003] However, the epoxy resin has the disadvantage of insufficient toughness after curing, and cannot effectively exert the performance of carbon fiber. When the carbon fiber composite material is under load, the composite material is often destroyed due to the premature failure of the epoxy resin. In order to meet the needs of high-performance carbon fiber composite materials for mat...

Claims

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Application Information

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IPC IPC(8): C08G59/20C08G59/50C08G59/56C08G59/62C08K3/26C08K3/22C08K3/36C08K3/34
Inventor 杨刚孟秀青陈伟明胡伟刘欣彤
Owner BLUESTAR BEIJING CHEM MACHINERY
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