Substrate for high whiteness LED packaging

Abstract

The invention provides a substrate for packaging high-whiteness LEDs, which is characterized in that: the whiteness of the light-emitting surface used for mounting LEDs on the substrate is ≥70, more preferably ≥85, and most preferably ≥88; the substrate is made of ceramics substrate or glass. The invention has the following advantages: after adopting the high-whiteness substrate made of ceramics or glass, the production process of the traditional reflective layer on the metal base of the LED can be reduced, which not only simplifies the production process, but also greatly saves the production cost, which is beneficial to mass production. Industrialized production, at the same time, the base can be directly produced by prefabrication, so that the whiteness is ≥70, more preferably ≥85, and the best is ≥88. As the whiteness of the base is improved, the light extraction efficiency of the LED chip will be greatly improved, so the loss of light energy converted into heat energy can be greatly reduced, so its heat dissipation performance will also be greatly improved, and the LED lamp made of it has good safety performance , non-conductive, not fragile, and the service life is greatly improved.

Description

technical field [0001] The invention relates to a lighting device, in particular to an LED lamp. Background technique [0002] LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various lighting devices. Traditional LED bulbs use metal materials as the substrate for LED packaging. Because the whiteness of the metal substrate itself is relatively low Low, so if it is directly made into the package base of the LED lamp without treatment, its reflective efficiency is not high, especially in the application of high-power LEDs, due to its high heat generation, the product life is low; therefore, the existing metal substrate The luminous surface will be treated first, such as brushing a layer of white paint on the surface as a reflective layer or laminating a layer of white reflective layer to improve its whiteness, but this method, first of all, its process is more complicated and the production cost is higher. At the same time, ...

AI Technical Summary

Problems solved by technology

[0002] LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various lighting devices. Traditional LED bulbs use metal materials as the substrate for LED packaging. Because the whiteness of the metal substrate itself is relatively low Low, so if it is directly made into the package base of the LED lamp without treatment, its reflective efficiency is not high, especially in the application of high-power LEDs, due to its high heat generation, the product life is low; therefore, the existing metal substrate The luminous surface will be treated first, such as brushing a layer of white paint on the surface as a reflective layer or laminating a layer of white reflective layer to improve its whiteness, but this method, first of all, its process is more complicated and the production cost is higher. At the same time, due to the addition of a reflective layer, the heat dissipation performance of the traditional LED light source module packaging structure is greatly reduced, and it is even more difficult to solve the heat dissipation problem of high-power LED light source modules