A kind of preparation method of sintered NdFeB device
A technology of NdFeB devices, which is applied in the field of preparation of sintered NdFeB devices, can solve the problems of scrapping defective products, material loss, and increasing costs, and achieve the effects of reducing raw material loss, reducing damage rate, and saving production costs
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Embodiment 1
[0028] Embodiment one: if figure 1 Shown, a kind of preparation method of sintered NdFeB device, take a substrate 3 that is suitable for sintered NdFeB device, open a groove 6 on the upper surface of substrate 3; The depth of groove 6 is 0.05mm, will A nickel alloy foil 4 with a thickness of 0.05 mm is inserted into the groove 6 of the base 3; a surrounding frame 5 with a cavity 2 matching the shape of the base 3 is made, and the groove 6 of the base 3 is placed upwards At the bottom of the cavity 2, a material tray composed of a matrix 3 and a frame 5 is obtained; the NdFeB fine powder 1 is filled in the cavity 2 and the NdFeB fine powder 1 is compacted, and the specific structure is as follows figure 2 As shown; the tray filled with NdFeB fine powder 1 is moved into the electromagnetic field generating device to orient the NdFeB fine powder 1; the tray after orientation treatment is placed in the sintering pot, and then the sintering pot is moved into the sintering furnace ...
Embodiment 2
[0030] Embodiment 2: A preparation method of sintered NdFeB devices is basically the same as Embodiment 1, the only difference is
[0031] The depth of the groove 6 is 0.30mm, and the thickness of the corresponding nickel alloy foil 4 is also 0.30mm.
Embodiment 3
[0032] Embodiment 3: A preparation method of sintered NdFeB devices, which is basically the same as Embodiment 1, the only difference is
[0033] The depth of the groove 6 is 0.30 mm, and the thickness of the corresponding nickel alloy foil 4 is 0.20 mm.
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