A single crystal short rod splicing method using diamond wire cutting

Abstract

The invention discloses a single crystal short rod splicing method using diamond wire cutting. First, the end face of the single crystal silicon short rod is detected, and the flatness of the end face is required to be less than 0.3mm, and then the short rod is bonded by coating the end face with glue. After bonding, it is pressurized and solidified, and then the splicing rods are squared, end-face ground, and rolled. After passing the inspection, the splicing rods are cut into single-crystal silicon wafers in the slicing cabin. Make full use of all short monocrystalline silicon rods, greatly improve the utilization rate of short monocrystalline silicon rods, and reduce production costs. Since the splicing rods are not perpendicular to the diamond wire, the diamond wire does not need Adjusting the position of the wire cutting device can make the diamond wire never appear empty when cutting the splicing rod. The splicing rod method of the present invention can make full use of the single crystal silicon short rod to be processed into silicon wafers, which improves the round silicon The utilization rate of rods reduces the processing cost.

Description

technical field [0001] The invention belongs to a method for splicing silicon crystal rods by using diamond wire-cut single crystals in the photovoltaic industry. Background technique [0002] In the growth of single crystal, the amount of feed, the control of crystal diameter, and the control of pot bottom material will all have an impact on the length of the crystal. In the fixed-length round rod, there will be a lot of residual material (short rod) that does not meet the fixed length. In addition, a certain amount of short rods will be produced when the edge is broken, so it is impossible to produce fixed-length silicon crystal rods according to our cutting requirements. After slitting to fixed lengths, a considerable proportion of stubs are produced. For the processing of short rods, one method at present is to return them to the furnace and remelt them. The second is to adjust the size of the wire cutting device. Remelting increases losses, consumes energy, increases m...

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Problems solved by technology

[0002] In the growth of single crystal, the amount of feed, the control of crystal diameter, and the control of pot bottom material will all have an impact on the length of the crystal. In the fixed-length round rod, there will be a lot of residual material (short rod) that does not meet the fixed length. In addition, a certain amount of short rods will be produced when the edge is broken, so it is impossible to produce fixed-length silicon crystal rods according to our cutting requirements. After slitting to fixed lengths, a considerable proportion of stubs are produced

For the processing of short rods, one method at present is to return them to the furnace and remelt them. The second is to adjust the size of the wire cutting device. Remelting increases losses, consumes energy, increases man-hour costs, and increases use costs; adjust cutting process parameters and device, it will reduce the processing efficiency of the cutting machine, increase the cost of working hours, affect the processing progress, and is not conducive to large-scale processing

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