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Discrete igbt modules and substrates

A substrate and module technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of low assembly efficiency, difficulty in ensuring the insulation and heat dissipation effect of IGBT and metal plate at the same time, and achieve high assembly efficiency and good heat dissipation effect , the effect of quick installation

Inactive Publication Date: 2011-12-28
佛山市顺德区和而泰电子科技有限公司
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AI Technical Summary

Problems solved by technology

However, the traditional assembly method needs to install six discrete IGBTs separately, and the assembly efficiency is low; in addition, the insulating material between the IGBT and the radiator metal plate is difficult to ensure the insulation and heat dissipation effect between the IGBT and the metal plate at the same time

Method used

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  • Discrete igbt modules and substrates
  • Discrete igbt modules and substrates
  • Discrete igbt modules and substrates

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Embodiment Construction

[0023] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] Such as figure 1 As shown, the top view of the substrate of a sub-main IGBT module mentioned in an embodiment of the present invention includes:

[0025] A groove 10 matching the IGBT, where the IGBT is placed;

[0026] The through holes 20 matched with the screws are used to install the screws to fix the base plate on the heat sink metal plate.

[0027] The material of the substrate in the above embodiments is ceramic, which has good insulation and heat dissipation. The shape of the above-mentioned groove 10 is consistent with that of the IGBT, which can play the role of positioning the IGBT. During assembly, the IGBT is placed in the groove 10, and an easily curable insulating material, such as epoxy resin, is poured on the top of the IGBT to complete the package. A module is formed, that is, a discrete IG...

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Abstract

The invention discloses a discrete IGBT module and a substrate, the substrate includes: a groove matching with the IGBT, for placing the IGBT; a through hole matching with a screw, for installing the screw, so that the substrate is fixed to the radiator metal plate. The discrete IGBT module and substrate proposed by the present invention can realize rapid installation of IGBT, high assembly efficiency, and can meet mass production; through the cooperation of discrete IGBT and ceramic substrate, the heat dissipation effect is good; the good insulation performance of ceramic substrate is used to solve the problem of Effective insulation between the IGBT and the radiator metal plate; keep the thickness of the substrate consistent with the thickness of the surrounding components to ensure the flatness of each component during installation.

Description

technical field [0001] The invention relates to a module, in particular to a discrete IGBT module and a substrate. Background technique [0002] IPM (Intelligent Power Module, Intelligent Power Module), which is widely used in inverter air conditioners, has the characteristics of high reliability and easy use. It is suitable for inverters and various inverter power supplies that drive motors. It is an ideal power electronic device in metallurgical machinery, electric traction, servo drive, frequency conversion home appliances and other fields. However, since manufacturers often use their own defined packaging methods when packaging IPMs, the specifications of IPMs packaged by various manufacturers are different, so that different IPM modules must be supported by corresponding drive circuits and PCB boards, resulting in IPMs of various specifications. are not compatible with each other. In order to break this deadlock, 6 discrete IGBTs (Insulated Gate Bipolar Transistor, in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/15H01L23/40H01L23/373
Inventor 孙冬晨王建余冠涛
Owner 佛山市顺德区和而泰电子科技有限公司
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