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Copper-based contact material for low-voltage apparatus

A technology for contact materials and low-voltage electrical appliances, applied in the direction of metal/alloy conductors, etc., can solve the problems that the anti-oxidation performance cannot meet the working life of low-voltage electrical appliances, the high cost of copper-based contact materials, and the increased contact resistance of contacts, etc., to achieve excellent Antioxidant performance, excellent antioxidation performance, stable contact resistance effect

Inactive Publication Date: 2012-01-04
FUDA ALLOY MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the main disadvantage of copper as an electrical contact material is its poor oxidation resistance. Once an oxide film is formed on the surface of the copper contact, the contact resistance of the contact will increase, causing the temperature rise of the electrical appliance to be too high, and even the electrical appliance will fail.
Although rare earth elements are added in the prior art to improve the anti-oxidation performance, its anti-oxidation performance still cannot meet the requirements of the working life of low-voltage electrical appliances, and the rare earth elements themselves are also scarce resources, and the price is getting higher and higher, making copper-based contact materials high cost

Method used

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  • Copper-based contact material for low-voltage apparatus
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  • Copper-based contact material for low-voltage apparatus

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Experimental program
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Embodiment 1

[0025] The composition and mass percentage of the copper alloy material: graphite 1%, boron 0.5%, the balance is CuNi alloy powder, wherein the Ni content is 3%, and the balance is copper. Its performance indicators: resistivity 4.5μΩ cm, density 8.66g / cm 3 , hardness HB93.

Embodiment 2

[0027] The composition and mass percentage of the copper alloy material: graphite 0.5%, boron 1%, the balance is CuNiLa alloy powder, the Ni content in the CuNiLa alloy is 2%, and the La content is 1%. Its performance indicators: resistivity 3.8μΩ cm, density 8.63g / cm 3 , hardness HB95.

Embodiment 3

[0029] The composition and mass percentage of the copper alloy material: graphite 1%, the balance is CuLa alloy powder, and the La content in the CuLa alloy is 1%. Its performance index: resistivity 2.25μΩ·cm, density 8.64g / cm 3 , hardness HB83.

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Abstract

The invention discloses a copper-based contact material for a low-voltage apparatus. The copper-based contact material comprises the following components in percentage by mass: 0.01-3 percent of graphite, 0.01-5 percent of boron and the balance of copper alloy. The copper-based contact material has the characteristics of high electric conductivity, heat conductivity, arc burning resistance, welding resistance, excellent anti-oxidant performance, low and stable contact resistance and the like, substitutes a silver alloy contact for the low-voltage apparatus so as to reduce the cost, and meets the European requirement for restriction of the use of certain hazardous substances (ROHS).

Description

technical field [0001] The invention belongs to the technical field of electrical contact materials, and specifically refers to a copper-based contact material for low-voltage electrical appliances. Background technique [0002] Contact materials are the key materials of various switches, relays, contactors and other electrical appliances, which play the role of connecting, breaking and transmitting current. At present, silver-based materials are widely used in electrical contact materials at home and abroad. Silver is a precious metal, which makes the cost of silver in industrial production quite high, and my country is a country with relatively poor silver reserves. Therefore, it is an inevitable trend to find new materials that can replace silver, especially Especially as a contact material industry that uses a large amount of silver, it is of far-reaching significance to find new materials to replace silver. [0003] For many years, many scientific and technological work...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02
Inventor 谢继峰柏小平翁桅林万焕刘立强颜小芳
Owner FUDA ALLOY MATERIALS
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