LED (light emitting diode) printed circuit board and production method thereof
A technology for printed circuit boards and production methods, which is applied in the direction of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problems of loss of tool life, high processing costs, and impact on mold life, so as to reduce molding processing costs, The effect of increasing stroke life and improving production efficiency
Inactive Publication Date: 2012-01-11
深圳松维电子股份有限公司
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Problems solved by technology
[0002] Existing LED printed circuit boards are mainly made of aluminum-based materials. The aluminum substrate of the aluminum-based printed circuit board can only dissipate heat, not conduct heat, and the overall heat dissipation effect of the printed circuit board is poor.
Moreover, the material cost of aluminum-based printed circuit boards is relatively high, the forming process is relatively difficu...
Method used
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[0023] exist Figure 2 to Figure 4 In the shown embodiment of the LED printed circuit board of the present invention, the LED printed circuit board adopts double-sided copper-clad laminates (such as paper material boards: FR-1, FR-2; glass fiber material boards: CEM-1, CEM-3 , FR-4, etc.) production. The front copper foil 1 includes pads 101, traces (not shown in the figure), and a heat dissipation copper foil 102 insulated from the pads and traces; through-holes 2 pass through the board body, connecting the heat dissipation copper foil 1 and the back copper foil 3. A rivet-shaped heat-conducting copper glue 4 is injected into the through hole, and the rivet-shaped heat-conducting copper glue 4 connects the heat-dissipating copper foil 1 and the back copper foil 3 .
[0024] In this embodiment, the diameter d of the through hole 2 is 0.3 mm. The diameter D of the head of the heat-conducting copper colloid is 0.6 mm for the diameter of the through hole 2 . The heat-conductin...
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The invention discloses an LED (light emitting diode) printed circuit board and a production method thereof. The LED printed circuit board comprises a front copper foil, a back copper foil and a plurality through holes, wherein the front copper foil comprises a bonding pad, a wire and a heat-radiating copper foil which is insulated from the bonding pad and the wire; the through holes pass through a board body, and are communicated with the heat-radiating copper foil and the back copper foil; and the insides of the through holes are filled with rivet-shaped heat-conducting copper colloids, and the rivet-shaped heat-conducting copper colloids are connected with the heat-radiating copper foil and the back copper foil. According to the invention, the heat generated by an LED is conducted into the back heat-radiating copper foil by utilizing the outstanding heat-conducting performance of the copper colloid, thereby improving the heat-conducting efficacy of the LED printed circuit board, overcoming the defects that an aluminum-based material in the prior art only can achieve an effect of heat radiation but not heat conduction, and improving the heat radiation effect of the LED printed circuit board. The LED printed circuit board and production method thereof provided by the invention are suitable for the continuous production of molds, the stroke-frequency service life of a produced mold can be prolonged, the production efficiency is improved, and the formation machining cost of the LED printed circuit board is lowered.
Description
[technical field] [0001] The invention relates to a printed circuit board, in particular to an LED printed circuit board and a production method thereof. [Background technique] [0002] Existing LED printed circuit boards are mainly made of aluminum-based materials, and the aluminum substrate of the aluminum-based printed circuit board can only dissipate heat, not conduct heat, and the overall heat dissipation effect of the printed circuit board is relatively poor. Moreover, the material cost of the aluminum-based printed circuit board is relatively high, the forming process is relatively difficult, and the processing cost is also relatively high. The heat generated during CNC forming consumes the service life of the tool; during the stamping and forming of the mold, the mold produces static adsorption of aluminum chips, which affects the life of the mold, and the continuous production of stamping and forming of the mold is difficult, and continuous production will lead to p...
Claims
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Login to view more IPC IPC(8): H05K1/02H05K3/00H01L33/62H01L33/64
Inventor 魏嘉政
Owner 深圳松维电子股份有限公司
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