Semiconductor processing device and gas spray head cooling plate thereof

Abstract

The invention discloses a gas spray head cooling plate comprising a cover plate and a base body, wherein the base body comprises a soleplate and a side wall; multiple cooling liquid separation devices are arranged on the soleplate at intervals; a cooling liquid channel used for passing cooling liquid is respectively formed between the adjacent cooling liquid separation devices; and a hole suitable for passing gas is respectively arranged on the cooling liquid separation devices so that the gas is evenly cooled by the gas spray head cooling plate. The invention also discloses a semiconductor processing device which comprises the gas spray head cooling plate.

Description

technical field [0001] The invention relates to a semiconductor device using gas to process devices, in particular to a gas shower head cooling plate capable of cooling gas and a semiconductor processing device including the gas shower head cooling plate. Background technique [0002] The gas shower head is used to provide one or more gases required by various manufacturing processes such as chemical vapor deposition (CVD) and metal organic vapor deposition (MOCVD). In many cases, the gas showerhead must be cooled in order to avoid possible chemical reactions of the gas inside the gas showerhead. Patent document US20100170438 discloses a gas shower head, such as figure 1 As shown, the gas shower head comprises an upper part 1, a lower gas distributor part 2, wherein the lower gas distributor part 2 is composed of a plurality of structured discs with a thickness of 1 mm, one structured disc is arranged on the other, Such multiple accumulated structured sites are finally con...

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Problems solved by technology

[0003] It can be seen from the above that the gas shower head includes a gas distribution device and a gas cooling device at the same time, and the two are welded together. Once damaged, it can only be replaced as a whole, and some parts cannot be replaced or repaired; the structure of the gas shower head is very complicated. , many of its internal structures need to be formed by an etching process, which increases the manufacturing cost; its multiple structured disks are connected together by high temperature and high pressure diffusion welding, which takes too long and is complicated. On the other hand, There are many welding seams in the gas outlet channel and the cooling water chamber of the gas shower head, and the distribution density of the gas outlet channel is very large. Once the coolant leaks, the cooling function will not be realized.

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