LED (Light-Emitting Diode) encapsulated lens

An LED packaging and lens technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of LED luminous brightness loss and inability to reduce light source loss, etc.

Inactive Publication Date: 2012-03-14
陈文彬
View PDF4 Cites 29 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, part of the light generated by the LED chip 20 is transmitted through the lens, and the other part of the light is reflected through the lens interface. After the light is reflected, it is absorbed by the surface of the carrier board 30, and there is no way to pass through the lens, resulting in loss of LED luminan

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED (Light-Emitting Diode) encapsulated lens
  • LED (Light-Emitting Diode) encapsulated lens
  • LED (Light-Emitting Diode) encapsulated lens

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to more clearly describe the features of the LED packaging lens proposed by the present invention, the following will be described in detail with reference to the drawings. In the present invention, an LED encapsulation lens is taken as an embodiment, which is described in detail with reference to the drawings.

[0026] The LED upstream epitaxial wafer is cut into a chip, and then the chip is pasted on the lead frame and enters the downstream LED packaging process. According to the application of different LED products, there are different LED chip packaging technologies and materials.

[0027] Generally speaking, the LED packaging lens is a plano-convex lens 10 , which is in the shape of a hemisphere, a dome, a semi-ellipse or a frustum of a dome (such as a truncated dome). The lens material can be glass, quartz or plastic. Among them, common plastic lens materials are: epoxy resin (epoxy), polycarbonate (PC), silicone (silicone) and the like.

[0028] fi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an LED (Light-Emitting Diode) encapsulated lens with a reflective film. The LED encapsulated lens comprises a plane-convex lens, wherein a reflective film is plated on the bottom plane of the plane-convex lens; and a groove is formed at the center of the bottom plane, so that the groove can be used for containing the LED when the plane-convex lens is encapsulated on a carrier plate of the LED. The reflective film is located on the bottom plane of the LED encapsulated lens, so that the light-emitting luminance of the LED is improved. The encapsulated lens can be matched with an optical filter to select light source wavebands. Furthermore, the encapsulated lens can be matched with an anti-reflection film to increase the light transmittance of the LED.

Description

technical field [0001] The invention relates to an LED (Light Emitting Diode) encapsulation lens, in particular to an LED encapsulation lens with a reflective film. Background technique [0002] When LED chips are exposed to the atmosphere for a long time, they will age due to the influence of water vapor or other chemical substances in the environment, resulting in a decline in characteristics. Selecting a suitable substrate can provide adequate mechanical protection for LED chips. Mainly used for LED substrates, including lead frames, metal substrates, low-temperature co-fired ceramic substrates, etc. Among them, the thermal expansion coefficient of the low temperature co-fired ceramic substrate is the closest to that of the semiconductor, which can provide a highly reliable LED substrate. [0003] Encapsulating light-emitting diodes with high-transparency epoxy resin and silicone encapsulation materials is a widely used encapsulation method. In order to improve the ligh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/48H01L33/58
Inventor 陈文彬
Owner 陈文彬
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap