Thermal processing apparatus

A technology of heat treatment device and heater, which is applied in the direction of post-processing device, post-processing, post-processing details, etc., can solve the problems of increasing the manufacturing cost of the vacuum insulation layer forming body, and achieve the effect of improving the bending strength

Inactive Publication Date: 2012-03-21
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is also considered to increase the thickness of the outer wall surface to prevent such bending of the outer wall surface, but this will increase the manufacturing cost of the vacuum heat insulating layer forming body.

Method used

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Embodiment Construction

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings. here, figure 1 is a schematic cross-sectional view showing one embodiment of the heat treatment apparatus according to the present invention. figure 2 Yes figure 1 magnified view of .

[0026] like figure 1 As shown, the heat treatment apparatus of the present invention is composed of a vertical heat treatment apparatus 1, which includes: a cylindrical reaction tube 3 with an upper surface and a side surface integrally formed and an opening on the lower surface; a wafer W is loaded and accommodated in a The boat 5 in the reaction tube 3, the heater 2 surrounding the reaction tube 3 and used to heat the inside of the reaction tube 3, and the outer periphery of the heater 2 to cover the periphery and the upper surface of the reaction tube 3 The vacuum heat insulating layer forming body 10 is arranged so as to surround the side surface of the reaction tube 3 .

[0027]...

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Abstract

There is provided a thermal processing apparatus in which the outer shell of a vacuum insulation layer-forming structure has an increased buckling strength. The thermal processing apparatus (1) includes a cylindrical reaction tube (3), a boat (5) for holding wafers W, a heater (2) provided around the reaction tube (3), and a vacuum insulation layer-forming structure (10) provided around the heater (2). The vacuum insulation layer-forming structure (10) includes an inner shell (11) and an outer shell (12) which forms a vacuum insulation layer (10a) between the outer shell (12) and the inner shell (11). The outer shell (12) is comprised of a thin plate having an undulating cross-sectional shape formed by plastic forming.

Description

technical field [0001] The present invention relates to a heat treatment device, in particular to a heat treatment device with a vacuum heat insulating layer for performing heat treatment processes such as oxidation, diffusion, and CVD (Chemical Vapor Deposition, chemical vapor deposition) of silicon wafers. Background technique [0002] Conventionally, there is a vertical heat treatment apparatus disclosed in Patent Document 1 as this type of heat treatment apparatus. This vertical heat treatment apparatus includes a cylindrical reaction tube arranged vertically so as to surround a space for accommodating wafers to be heat-treated from the periphery, and a heating tube that surrounds the reaction tube and is used to heat the inside of the reaction tube. device. Furthermore, a vacuum heat insulating layer forming body forming a vacuum heat insulating layer is provided on the outer periphery of the heater, and the power consumption of the heater is reduced by the vacuum heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/46C30B31/12H01L21/205H01L21/22H01L21/31H01L21/324
CPCC23C16/46C30B25/08C30B25/10C30B29/06C30B33/02C30B35/002H01L21/67109H01L21/22H01L21/205
Inventor 斋藤孝规中岛诚
Owner TOKYO ELECTRON LTD
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