Double-layer multi-channel power synthesis amplifier based on rectangular waveguide

Abstract

The invention relates to a double-layer multi-channel power synthesis amplifier based on rectangular waveguide, which comprises a power divider, a synthesizer and an amplifier chip array, wherein the amplifier chip array is clamped between the power divider and the synthesizer, and comprises a metal strip and a group of solid-state power amplifier chips fixed on the metal strip. The power divider and the synthesizer are identical in structure and respectively comprise two cuboid metal blocks, wherein a bottom face rectangular waveguide slot is arranged on the bottom face of each upper metal block, and a top face rectangular waveguide slot is arranged on the top face of each lower metal block. The bottom face rectangular waveguide slot and the top face rectangular waveguide slot are combined to form a rectangular waveguide cavity, and one end of a coaxial line extends into a branch waveguide cavity. The input end of each solid-state power amplifier chip is connected with the other end of the coaxial line corresponding to the power divider through a microstrip line, and the output end of each solid-state power amplifier chip is connected with other end of the coaxial line corresponding to the synthesizer. The double-layer multi-channel power synthesis amplifier has the advantages of being high in synthesizing efficiency, large in power capacity, wide in working bandwidth, good in radiating performance and the like.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave communication and radar application, and relates to a double-layer multi-channel power synthesis amplifier based on a rectangular waveguide. Background technique [0002] With the increasing demands of modern radio communications such as GPS, WLAN, SAR, LMDS, Bluetooth, and PCS, the radio frequency spectrum is already crowded. Therefore, higher spectrum resources must be developed. In addition, high-frequency communication also has characteristics that low-frequency communication does not have, such as large information capacity, fast speed, and high resolution. However, as the operating frequency continues to increase, especially after entering the microwave and millimeter wave frequency bands, the power output capability of a single solid-state device is greatly reduced, which is far from meeting the requirements of communication systems. Therefore, if you still want to u...

AI Technical Summary

Problems solved by technology

The traditional planar circuit power combination technology is no longer applicable due to some inherent defects such as limited combined power, low combined efficiency, narrow working bandwidth, and poor heat dissipation.

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