Device and method for controlling glue joint curing deformation of dissimilar material
A technology of curing deformation and dissimilar materials, applied in the bonding method of adhesive heating, temperature control without auxiliary power supply, etc. High adaptability, avoid large deformation effect
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Embodiment 1
[0028] Such as figure 1 As shown, this embodiment includes: heating and cooling mold 1, high expansion rate part 2, adhesive layer 3, low expansion rate part 4, heat insulation accessory 5, and heating mold 6, including: heating mold 6, low expansion rate part 4. The adhesive layer 3 and the thermal insulation accessories 5, the high expansion rate parts 2 and the heating and cooling mold 1 are stacked in sequence, and the thermal insulation accessories 5 and the adhesive layer 3 are located on the same plane; the low expansion rate parts 4 are The thermal expansion coefficient of low carbon steel is smaller than that of the high expansion rate part 2 aluminum alloy.
[0029] According to the coolant temperature estimation method, the thermal expansion coefficient of aluminum alloy is 23.6e -6 , Low carbon steel thermal expansion coefficient 11.3e -6 ~13.5e -6 , The heating temperature is 180°C according to the requirements of the adhesive selection, and the room temperature is 2...
Embodiment 2
[0037] In this embodiment, the low expansion rate part 4 is aluminum alloy, and its thermal expansion coefficient is 23.6e -6 , The high expansion rate part 2 is magnesium alloy, and its thermal expansion coefficient is 27.0e -6 . The coefficient of thermal expansion of low-expansion parts is smaller than that of high-expansion parts.
[0038] The heating temperature is selected at 80°C according to the requirements of the adhesive, and the room temperature is 20°C. The corresponding magnesium alloy plate temperature needs to be controlled at about 72°C. Since the temperature difference is not large, the cooling method can be air-cooled. Therefore, the heating and cooling mold 1 is omitted.
[0039] In this embodiment, the cooling temperature step is 1°C, the time step is 1 second, the heating time is 1800 seconds, and the corresponding cooling temperature is set to 73°C.
[0040] The specific form of the heating mold 6 is figure 2 As shown, the resistance wire heating method is s...
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