Unlock instant, AI-driven research and patent intelligence for your innovation.

Pressure-sensitive adhesive tape

A pressure-sensitive adhesive, pressure-sensitive adhesive layer technology, applied in the direction of pressure-sensitive films/sheets, film/sheet-like adhesives, adhesives, etc., can solve problems such as circuit disconnection or short circuit, contamination of semiconductor wafers, etc. , to achieve the effect of excellent adhesion, less pollution and excellent peeling performance

Inactive Publication Date: 2012-04-04
NITTO DENKO CORP
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, materials that can be co-extruded are thermoplastic resins, and in the case of using thermoplastic acrylic resins, thermoplastic styrenic resins, etc. as pressure-sensitive adhesive-forming materials, there is a problem in that Impurities can contaminate semiconductor wafers
In particular, when ions generated in the polymerization of the resin used to constitute the pressure-sensitive adhesive (for example, ions originating from a catalyst) remain in the pressure-sensitive adhesive layer and contaminate the circuit of the chip, such as disconnection of the circuit or short circuit trouble

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pressure-sensitive adhesive tape
  • Pressure-sensitive adhesive tape
  • Pressure-sensitive adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Amorphous propylene-(1-butene) copolymer polymerized with a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafseren H5002": constituent unit derived from propylene: 90 mol% / derived from 1 -Constituent unit of butene: 10 mol%, Mw=230,000, Mw / Mn=1.8) was used as a pressure-sensitive adhesive layer forming material.

[0066] An ethylene-vinyl acetate copolymer (manufactured by DU PONT-MITSUI POLYCHEMICALS, product name "Evaflex P-1007") was used as a substrate layer forming material.

[0067] The above-mentioned pressure-sensitive adhesive layer forming material (100 parts) and substrate layer forming material (100 parts) were respectively fed into an extruder to perform T-die melt-coextrusion (extruder: manufactured by GM ENGINEERING, Inc. .manufacturing, product name "GM30-28" / T-die: feeding combination system; extrusion temperature: 180°C), lamination of molten state resin and Si-coated PET separator (provided by Mitsubishi Chemical Corp...

Embodiment 2

[0069] A pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that the thickness of the pressure-sensitive adhesive layer was changed to 45 μm and the thickness of the substrate layer was changed to 85 μm.

Embodiment 3

[0071] A pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the thickness of the substrate layer was changed to 175 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a pressure-sensitive adhesive layer; and a base layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene- (1-butene) copolymer polymerized by using a metallocene catalyst, the amorphous propylene-(1-butene) copolymer having a weight-average molecular weight (Mw) of 200,000 or more and a molecular weight distribution (Mw / Mn) of 2 or less; and the base layer contains an ethylene-vinyl acetate copolymer.

Description

[0001] This application claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. 2010-207827 filed September 16, 2010, which is incorporated herein by reference. technical field [0002] The present invention relates to pressure sensitive adhesive tapes. Background technique [0003] Semiconductor wafers formed of silicon, gallium, or arsenic are produced as large-diameter products and patterned on their front side. Then, the backside is ground to reduce the thickness of the wafer to usually about 100 to 600 [mu]m, and the wafer is cut and divided into element pieces (dicing), followed by a mounting step. [0004] In the step of grinding the back surface of the semiconductor wafer (back grinding step), a pressure-sensitive adhesive tape is used to protect the pattern surface of the semiconductor wafer. The pressure sensitive adhesive tape is typically peeled off after the backgrinding step. The pressure-sensitive adhesive tape used for this purpose needs to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J123/14H01L21/304H01L21/683C09J7/22C09J7/24C09J7/38
CPCH01L21/6836C09J2431/006C09J2423/10C08L23/0853C09J7/0267C09J7/0246C09J123/142C09J2423/046C09J7/38C09J7/22C09J7/24Y10T428/2878C09J7/30H01L21/67132H01L2221/68327C09J2203/326C09J2301/312
Inventor 生岛伸祐土生刚志浅井文辉大山高辉鸟居忠雄龟井胜利加藤有树高桥智一
Owner NITTO DENKO CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com