Heat treatment method for target material

A heat treatment method and target material technology, which is applied in the field of semiconductor manufacturing, can solve problems such as uneven structure and poor effect, and achieve the effects of uniform structure, shortened heat treatment time, and increased mass production speed

Active Publication Date: 2013-12-11
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology

[0008] The purpose of the present invention is to provide a target heat treatment method to solve the problem in the prior art that the structure of the target is uneven due to uneven heating in the heat treatment process, which leads to the poor effect of the electroplating process when the target is used as an anode question

Method used

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  • Heat treatment method for target material
  • Heat treatment method for target material
  • Heat treatment method for target material

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example

[0056] The following takes 4N5 or 5N copper-phosphorus alloy target as an example to illustrate the process steps and results of heat treatment in the target heat treatment method of the present invention:

[0057] (1) Provide copper-phosphorus alloy targets after plastic deformation process. The copper-phosphorus alloy target material through the plastic deformation process has a structure with a better grain size.

[0058] (2) Preheat the sand to 700°C in a constant temperature furnace. What described sand adopts is No. 45 silicon carbide (45#SiC).

[0059] (3) Submerging the copper-phosphorus alloy target into the preheated sand in the constant temperature furnace, so that the periphery of the copper-phosphorus alloy target is covered by the sand.

[0060] (4) Heat treatment of the copper-phosphorus alloy target. Specifically include: the heating temperature is 750°C, and the temperature is kept at this temperature for 60 minutes.

[0061] (5) Rough machining of the hea...

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Abstract

The present invention provides a heat treatment method for a target material. The method comprises: providing a target material, wherein the target material is a copper-phosphorus alloy; preheating sand; coating the target material by the sand; carrying out a heat treatment for the target material. Compared to the prior art, with the present invention, the heating method of the sand bath preheating is adopted, such that the uniform heating of the target material is ensured, the uniformity of the target material organization structure is achieved, and the electroplating requirements are met.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a target heat treatment method. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on some metal surfaces using the principle of electrolysis. It uses the principle of electrolysis to attach a layer of metal film to the surface of metal or other material parts, so as to prevent corrosion, improve wear resistance, conductivity, reflectivity and enhance the appearance. [0003] In the plating tank filled with electroplating solution, the cleaned and specially pretreated parts to be plated are used as the cathode, and the plated metal is used as the anode, and the two poles are respectively connected to the negative and positive poles of the DC power supply. The electroplating solution is composed of an aqueous solution containing metal plating compounds, conductive salts, buffers, pH regulators and additives. Af...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C21D1/68C22F1/08
Inventor 潘杰姚力军王学泽陈勇军
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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