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Photocurable resin composition and cured product thereof

A technology for printed circuit boards and curable resins, applied in printed circuit parts, printed circuit secondary treatment, optics, etc., can solve problems such as defects, and achieve reduced halogen gas generation, excellent concealment, and low halogen content Effect

Active Publication Date: 2012-04-18
TAIYO HLDG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Among the discoloration of such a copper circuit, the worst phenomenon is that even on the same copper circuit, only the edge of the circuit (the part where the resist is thinned) is discolored.
In such a case, when inspecting and mounting the board, it is not aligned with the inspection data, even if it is a good product, it will become defective

Method used

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  • Photocurable resin composition and cured product thereof
  • Photocurable resin composition and cured product thereof
  • Photocurable resin composition and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7 and comparative example 1～2

[0117] The varnish (A-1) obtained in the synthesis of the carboxylic acid-containing resin and the components shown in Table 1 were kneaded at the compounding ratios shown in Table 1 using a three-roll mill to obtain a photocurable resin composition.

[0118] Table 1

[0119]

[0120] About the photocurable resin composition of Examples 1-7 and Comparative Examples 1-2, performance and characteristic were evaluated according to the following evaluation criteria. The results are shown in Table 2.

[0121] Performance evaluation:

[0122]

[0123] The circuit pattern substrate with a copper thickness of 35 μm is polished and ground, washed with water, dried, and then the photocurable resin composition of Examples 1-7 and Comparative Examples 1-2 is coated on the entire surface by the screen printing method. Dry in a circulating drying oven for 60 minutes. After drying, use an exposure device equipped with a metal halide lamp to expose through a step exposure meter (Kodak...

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Abstract

To provide a colored photocurable resin composition capable of forming a solder resist layer excellent in property of hiding defective appearance of a copper circuit attributed to tarnish by oxidation. The photocurable resin composition can be developed with a dilute alkali solution and comprises: (A) a carboxylic acid-containing resin; (B) a photopolymerization initiator; c a compound having two or more ethylenically unsaturated groups per molecule; and (D) a red colorant.

Description

[0001] This application is a divisional application of an application with a filing date of May 8, 2008, an application number of 200810081857.5, and an invention title of "photocurable resin composition and its cured product, dry film, and printed circuit board". technical field [0002] The present invention relates to a colored photocurable resin composition not containing halogen-containing phthalocyanine green. More specifically, the present invention relates to a colored photocurable resin composition that does not contain halogen-containing phthalocyanine green and can provide a solder resist layer excellent in concealment of discoloration due to oxidation of copper circuits. Background technique [0003] Typically, solder resist is formed to protect copper circuits. This is useful in that discoloration due to heat and moisture in the copper circuit, electrical discoloration, flaws and contamination on the copper circuit cannot be seen. [0004] The solder resist is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K1/02H05K3/28
CPCC08F2/50G03F7/027G03F7/028G03F7/029G03F7/033G03F7/038G03F7/0388
Inventor 岩山弦人木村纪雄有马圣夫
Owner TAIYO HLDG CO LTD
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