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Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material

A technology of polyorganosiloxane and electronic devices, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., and can solve problems such as poor processability and easily damaged interface adhesion of polyorganosiloxane

Inactive Publication Date: 2014-11-05
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the polyorganosiloxane may be easily damaged or have poor interfacial adhesion due to high coefficient of thermal expansion after curing, and may also suffer from poor processability due to high surface tackiness

Method used

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  • Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material
  • Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material
  • Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0130] Synthesis of the first polyorganosiloxane

[0131] Synthesis Example 1

[0132] Add 158.65g (1.2mol) of dicyclopentadiene into a five-necked flask containing 600g of toluene. The flask is equipped with a stirrer, temperature controller, nitrogen injector, cooler, and Dean-Stark. Separator (Dean-Stark trap), nitrogen gas flows through the flask and is dissolved in it. At this time, PS-CS-1.8CS (Unicore) was added thereto so that the Pt concentration of the reaction solution was 20 ppm. In about 30 minutes, 332g (1mol) 3,3-diphenyl-1,1,5,5-tetramethyltrisiloxane dissolved in 600g of toluene was slowly added dropwise to the solution to prepare the Solution. Then, the reaction solution was heated to reflux for 24 hours. The resulting reaction solution was passed through a 5 cm thick silica gel column to remove the platinum complex. The solvent was removed under reduced pressure distillation, thereby preparing a linear polyorganosiloxane resin (A-1).

[0133] The number aver...

Embodiment 1

[0154] 3.83g of the polyorganosiloxane resin (A-1) of Synthesis Example 1, 5g of the polyorganosiloxane resin represented by the above chemical formula 3a, and 2.03g of 3,3-diphenyl-1,1,5 were mixed , 5-tetramethyltrisiloxane, and PS-CS-1.8CS (Unicore) to prepare a polyorganosiloxane resin composition so that the Pt concentration of the reaction solution is 3 ppm.

Embodiment 2

[0156] 1.65g of the polyorganosiloxane resin (A-1) of Synthesis Example 1, 5.3g of the polyorganosiloxane resin represented by the above chemical formula 3a, 2.07g of 3,3-diphenyl-1,1, 5,5-tetramethyltrisiloxane, and 3,3-diphenyl-1,1,5,5-tetramethyltrisiloxane, and PS-CS-1.8CS (Unicore) The polyorganosiloxane resin composition was prepared so that the Pt concentration of the reaction solution was 3 ppm.

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Abstract

A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,

Description

Technical field [0001] The present invention relates to a polyorganosiloxane composition, an encapsulating material obtained from the polyorganosiloxane composition, and an electronic device including the encapsulating material. Background technique [0002] Light emitting elements such as light emitting diodes (LED), organic light emitting devices (OLED), photoluminescence (PL) devices, etc. have been applied to household appliances, lighting devices, display devices, various automatic devices, etc., respectively. [0003] The light-emitting element can display inherent colors such as blue, red, and green by using luminous bodies, or can display white by combining luminous bodies of different colors. [0004] Such light-emitting elements usually have a packaging or packaging structure. [0005] Such a packaging or packaging structure may be made of a packaging material including a transparent resin, in which light emitted from the light emitting element can pass through the transpare...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08K5/5419H01L33/56C09K3/10
CPCC08G77/20C08G77/70C08G77/80H01L23/296C08L83/04C08G77/12H01L2924/12044H01L2924/0002C08L83/00H01L2924/00C08G77/04C09K3/10H01L23/29
Inventor 高尚兰申峻乎金佑翰车承桓安炫贞
Owner CHEIL IND INC