Hand-held suction pen free of charging

Abstract

The invention relates to a hand-held suction pen free of charging. The suction pen comprises a piston device, a suction nozzle device and a hand held device. The piston device includes: a cavity; a piston, which is arranged in the cavity; and a connecting rod, which is connected with the piston. The suction nozzle device is arranged at one end of the piston device as well as is ventilated with the piston device. And the hand held device is connected with the connecting rod and is used for pulling the connecting rod, thereby pushing the piston to make movements in the cavity. According to the hand-held suction pen free of charging in the invention, a piston device is utilized to generate a negative pressure so as to suck a silicon chip; and the suction pen can be carried conveniently and there is no need for charging.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing technology, in particular to a hand-held charge-free suction pen. Background technique [0002] With the continuous improvement of integrated circuit manufacturing technology, the degree of automation of semiconductor manufacturing is getting higher and higher, which makes the transfer of silicon wafers in most cases automatically carried out by machines. However, for some small companies without automated production lines and laboratories of some universities and research institutes, it is often necessary to manually transfer silicon wafers. Even in large companies with a high degree of automation, manual transfer and processing of silicon wafers still occurs from time to time. One situation is that when performing some special processes, in order to control contamination and prevent cross-contamination, public machines cannot be used. Silicon wafers can only be transpor...

AI Technical Summary

Problems solved by technology

However, for some small companies without automated production lines and laboratories of some universities and research institutes, it is often necessary to manually transfer silicon wafers

Even in large companies with a high degree of automation, manual transfer and processing of silicon wafers still occurs from time to time. One situation is that when performing some special processes, in order to control contamination and prevent cross-contamination, public machines cannot be used. Silicon wafers can only be transported manually; another situation is that due to the high precision, high complexity and high integration of semiconductor equipment, the overall high failure rate of semiconductor equipment, the occurrence of machine failures often leads to process The silicon wafers in progress or the silicon wafers in the process of transmission stay inside the machine and cannot be automatically transported out. Equipment engineers need to troubleshoot and manually take out the silicon wafers from the machine and put them into the cassette. Due to the lack of suitable tools, the equipment Engineers often take out silicon wafers directly by hand. Although they are protected by gloves, the risk of damage to the machine and scratches or contamination on the surface of the silicon wafer is very high.

[0003] At present, the main tools for manually transporting silicon wafers are as follows: the first is the suction pen directly connected to the vacuum system of the clean room through a hose. Transmission, and the establishment of the connection point of the clean room vacuum system and the continuous loss of the suction pen to the vacuum will increase the cost; the second is a hand-held suction pen that needs to be charged and generates negative pressure through the rotation of the motor to generate suction. The disadvantages are It needs to be equipped with a special charging socket and base, and there is often a risk of insufficient power during use, which may cause the silicon chip to fall, and its manufacturing cost is also high; the third is a silicon chip clip similar in shape to tweezers, although this clip Low cost and easy to carry and use, but the method is not to adsorb the back of the silicon wafer, but to move the silicon wafer by clamping the edge of the silicon wafer, which can easily cause contamination or scratches on the front of the silicon wafer.

Images