Calibrating method and device for online membrane thickness measuring system

The technology of a measurement system and a calibration method is applied in the field of calibration method and calibration device of an online film thickness measurement system, which can solve problems such as limitations and achieve the effect of accurate calibration.

Active Publication Date: 2012-05-09
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the wafer size has reached a diameter of more than 300mm, and the characteristic line widt...

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  • Calibrating method and device for online membrane thickness measuring system
  • Calibrating method and device for online membrane thickness measuring system
  • Calibrating method and device for online membrane thickness measuring system

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Embodiment Construction

[0034] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0035] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or elem...

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Abstract

The invention discloses a calibrating method for an online membrane thickness measuring system. The method comprises the following steps of: detecting polishing pressures on a plurality of wafers, and polishing the plurality of wafers in preset degrees respectively when the polishing pressures reach a preset pressure value; after polishing is completed, acquiring on-wafer voltage and off-wafer voltage of each wafer respectively, and computing a difference value between the on-wafer voltage and the off-wafer voltage; measuring the coating thickness value of each wafer after polishing is completed; correlating the difference value between the on-wafer voltage and the off-wafer voltage of each wafer and the corresponding coating thickness value of each wafer after polishing is completed to generate a voltage difference value-membrane thickness calibration table; and calibrating the coating thickness of the online membrane thickness measuring system according to the voltage difference value-membrane thickness calibration table. The invention further discloses a calibrating method for the online membrane thickness measuring system. According to the invention, the coating thickness can be calibrated quickly and accurately with different polishing processes.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing of integrated circuits, in particular to a calibration method and a calibration device for an online film thickness measurement system. Background technique [0002] In IC (Integrated Circuit, integrated circuit) manufacturing technology, with the continuous improvement of product performance, the requirements for surface quality are getting higher and higher. As the basic material of integrated circuit chips, silicon wafers have surface roughness and surface flatness as one of the important factors affecting the etching line width of integrated circuits. Polishing is an important means of surface planarization. The CMP (Chemical mechanical polishing, chemical mechanical polishing) process is the most widely used global planarization technology, and occupies an important position in the IC manufacturing technology. CMP is a combined technology of mechanical grinding and che...

Claims

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Application Information

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IPC IPC(8): G01B7/06H01L21/66H01L21/67
CPCH01L22/20H01L22/12B24B49/10G01B21/042B24B49/16G01B7/06B24B37/005
Inventor 路新春曲子濂赵乾王同庆孟永钢
Owner TSINGHUA UNIV
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