Substrate structure

Abstract

The invention discloses a substrate structure. The substrate structure including a first metal substrate, a second metal substrate, a frame fixture, a first conductive layer, a second conductive layer, a first adhesive layer and a second adhesive layer is provided. The second metal substrate is stacked over the first metal substrate. The frame fixture is disposed around the first metal substrate and the second metal substrate. The first adhesive layer is disposed between the first conductive layer and the first metal substrate, and between the first conductive layer and the frame fixture. The first conductive layer is fixed on an upper surface of the frame fixture by the first adhesive layer. The second adhesive layer is disposed between the second conductive layer and the second metal substrate, and between the second conductive layer and the frame fixture. The second conductive layer is fixed on a lower surface of the frame fixture by the second adhesive layer.

Description

technical field [0001] The present invention relates to a substrate structure, and in particular to a substrate structure with better reliability. Background technique [0002] With the rapid development of the digital industry, the application of circuit boards in digital products is becoming more and more extensive. For example, there are circuit boards in products such as mobile phones, computers, and digital cameras. In the production of the circuit board, the circuit board can be made of a single-sided circuit substrate or a double-sided circuit substrate. [0003] In the existing single-sided circuit board manufacturing process, firstly, two copper foil layers and a core layer disposed between these copper foil layers are provided, and the copper foils and the core layer are laminated. Afterwards, the copper foil layer on one side is removed by etching to obtain a single-sided substrate. However, the existing manufacturing method not only wastes the copper foil layer...

AI Technical Summary

Problems solved by technology

However, the existing manufacturing method not only wastes the copper foil layer on one side, but also requires an additional etching process to remove the copper foil layer, so that the manufacturing process steps and manufacturing cost are increased.

Furthermore, if the core layer is made of a pair of metals with a faster reaction rate of the etchant, an additional protective layer must be formed to protect the core layer before the etching process can be performed to remove the copper foil layer, otherwise the core layer will be corroded by etchant, resulting in reduced reliability

Since an additional protective layer is required to protect the core layer, the manufacturing process steps and manufacturing costs will increase, which is not conducive to mass production

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