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Silicon-containing curable composition and cured product thereof

一种固化性组合物、化合物的技术，应用在涂层等方向，能够解决材料耐热性、密合性、着色性、透明性无法得到满足等问题，达到透明性优异、着色性优异的效果

Active Publication Date: 2012-05-23
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, although the technologies proposed in these documents each have their own characteristics, they cannot satisfy the heat resistance, adhesiveness, colorability, transparency, etc. required for materials in the recent electronic information field.

Method used

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  • Silicon-containing curable composition and cured product thereof
  • Silicon-containing curable composition and cured product thereof
  • Silicon-containing curable composition and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0113] Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited to these Examples. In addition, "part" and "%" in an Example are a unit based on mass.

Synthetic example 1

[0114] [Synthesis Example 1] Component (A): Synthesis of Prepolymer 1

[0115] Add 100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 100 parts of divinylbenzene, 60 parts of toluene, and 0.0005 parts of platinum-carbonylvinylmethyl complex (Ossko catalyst) while stirring A reflux treatment was performed for 5 hours. The solvent was distilled off from the reaction solution under reduced pressure at 70°C to obtain prepolymer 1 as the component (A).

[0116] The result of GPC analysis is: the molecular weight of prepolymer 1 is Mw=10000, by 1 The content of the hydrosilyl group (Si—H group) obtained by H-NMR was 5.3 mmol / g.

Synthetic example 2

[0117] [Synthesis Example 2] Component (A): Synthesis of Prepolymer 2

[0118] Add 100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 50 parts of divinylbenzene, 70 parts of 1-methoxy-2-propyl acetate and 0.0001 parts of platinum-carbonylvinylmethyl The complex (Ossko catalyst) was refluxed for 6 hours while stirring. The solvent was distilled off from the reaction solution under reduced pressure at 50° C. to obtain prepolymer 2 as the component (A).

[0119] The result of GPC analysis is: the molecular weight of prepolymer 2 is Mw=140000, by 1 The content of the hydrosilyl group (Si—H group) obtained by H-NMR was 5.2 mmol / g.

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Abstract

Disclosed is a silicon-containing curable composition comprising: (A) a prepolymer which has at least two Si-H groups per molecule and is produced by the hydroxylation reaction of at least one cyclic siloxane compound (a) represented by formula (1) and at least one compound (ss) represented by formula (2); (B) a cyclic siloxane compound having at least two carbon-carbon double bonds each capable of reacting with a Si-H group per molecule; (C) a polysiloxane compound that is different from the prepolymer (A) or the cyclic siloxane compound (B); and a hydrosilylation catalyst (D). In formula (1), R1 to R3 independently represent an alkyl group having 1 to 6 carbon atoms or a phenyl group; a represents a numeral value of 2 to 10; and b represents a numeral value of 0 to 8. In formula (2), n represents 1 or 2.

Description

technical field [0001] The present invention relates to a silicon-containing curable composition and a cured product thereof. The silicon-containing curable composition and its cured product are useful in electrical and electronic component materials, adhesives, and the like. Background technique [0002] Various studies have been conducted on silicon-containing compounds, and polysiloxane compounds represented by silicone resins, for example, have been used industrially for a long time. However, although silicone resins are excellent in heat resistance and flexibility, they are limited in use due to pollution problems in the manufacturing process of electronic components and the like because they contain many gas-releasing components (volatile components). [0003] In addition, in recent years, in the field of electronic information, along with the development of technology, various materials used have been required to have high performance, so research is being made on th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/14C08L83/05C08L83/07C08G77/52
CPCC08G77/20C08L83/04C08K5/56C08G77/12C09D183/04C08L83/00C08G77/08C08G77/44C08G77/52C08L83/14
Inventor 斋藤雅子
Owner ADEKA CORP
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