Zener diode protection network in substrate for LEDs connected in series
A zener diode and light emitting diode technology, applied in the use of semiconductor lamps, electrical components, circuits, etc., can solve the problems of insufficient surface area of zener diode silicon
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[0027] As a preliminary matter, LEDs were formed on a growth substrate. In the example used, the LEDs are GaN-based LEDs, such as AlInGaN or InGaN LEDs, which are used to generate UV by green light. Typically, a relatively thick n-type GaN layer is grown on a sapphire growth substrate using conventional techniques. Relatively thick GaN layers typically include a low temperature nucleation layer and one or more additional layers to provide a low defect lattice structure for the n-type cladding layer and active layer. Then, one or more n-type cladding layers are formed over the thick n-type layer, followed by the active layer, one or more p-type cladding layers, and a p-type contact layer (for metallization).
[0028] For flip-chip, portions of the p-layer and active layer are etched away to expose the n-layer for metallization. In this way, the p-contact and n-contact are on the same side of the chip and can be electrically attached directly to the substrate contact pads. Cu...
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