A camera
system uses one or more
image sensor IC chips each having multiple pixel arrays on the same
semiconductor substrate (i.e., “multiple pixel arrays on a
chip”). In one embodiment, such a camera
system includes: (a) optical components that create multiple images in close physical proximity of each other (e.g., within a few millimeters or centimeters); and (b) a single sensor substrate (“
chip”) containing multiple 2-dimensional pixel arrays that are aligned to capture these multiple images, so as to convert the multiple images into electrical
signal. The pixel arrays can be manufactured using a CCD or a
CMOS compatible process. For manufacturing reasons, such a
chip is typically two centimeters or less on a side. However, large chips can also be made. Optional electronic components for further
signal processing of the captured images may be formed either on the sensor chip (i.e., in a “
system-on-a-chip” implementation), or in a separate back-end
application specific integrated circuit (ASIC). In addition,
digital storage components, display elements, and wired or
wireless communication links may also be included in any suitable combination to allow review and further
processing of the captured images.