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Diamond wire saw with stranded core and manufacturing process thereof

A technology of diamond wire saw and core wire, which is applied in the direction of cutting tool manufacturing, manufacturing tools, metal sawing equipment, etc. of sawing machine devices, and can solve problems affecting the surface quality of cut products, diamond wire saw breakage, and affecting production efficiency, etc., to increase Life and repeated use times, less clogging with sawdust, and improved reliability

Inactive Publication Date: 2012-06-13
李园
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: the diamond wire saw is subjected to a certain tension during use, the greater the tension, the faster the cutting speed, and the wire saw will bend during use. With the increase of processing times, the diamond wire saw is very easy to Bending fatigue or stress impact during cutting and fracture, so the existing diamond wire saw often breaks when the surface abrasive layer is still usable, poor reliability
Wire breakage during cutting not only affects production efficiency, but also seriously affects the surface quality of cut products. For example, silicon wafers are often scrapped in batches due to wire saw breakage
In addition, after the diamond abrasive layer is worn and peeled off, the worn diamond wire saw becomes a waste product and cannot be reused.

Method used

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  • Diamond wire saw with stranded core and manufacturing process thereof
  • Diamond wire saw with stranded core and manufacturing process thereof
  • Diamond wire saw with stranded core and manufacturing process thereof

Examples

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0026] In the description of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", " The orientations or positional relationships indicated by "top", "bottom", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation, so they cannot be understood as Lim...

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Abstract

The invention provides a diamond wire saw with a stranded core, which comprises the stranded core, a buffer layer and an abrasive layer, wherein the stranded core is formed of multiple stranded metal wires, and the abrasive layer is provided with diamond abrasive grains. The diamond wire saw with the stranded core has the advantages of high reliability, quick cutting, breakage resistance, long service life, easiness in recovery and the like.

Description

technical field [0001] The invention designs a metal or non-metal cutting device, in particular relates to a diamond wire saw with stranded core wires for cutting hard materials. Background technique [0002] Semiconductor element substrates are usually formed by effective cutting of brittle and hard materials such as silicon wafers, sapphire, gallium arsenide, and silicon carbide. Generally, a diamond wire saw with diamond abrasive grains fixed on the surface can be used. Compared with the traditional free abrasive method using suspension liquid, this diamond wire saw has less loss of the material to be cut, and the cutting efficiency has been significantly improved. And the cutting coolant can be composed of water-based solution, which is more green and environmentally friendly. [0003] Therefore, the diamond wire saw has attracted people's attention as a new generation of cutting tools. In the cutting process, in order to make full use of the diamond abrasive layer, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23D61/18B23D65/00
CPCB23D61/185
Inventor 李园
Owner 李园
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