High-performance organic silicon electronic pouring sealant and preparation method and application thereof

A technology of silicone and potting glue, applied in chemical instruments and methods, adhesives, other chemical processes, etc., can solve the problems of poor mechanical properties, low light transmittance, etc., to solve the problems of poor light transmittance and mechanical properties, improve The effect of light transmittance and mechanical properties

Inactive Publication Date: 2012-06-20
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In order to overcome the disadvantages of low light transmittance and poor mechanical properties of existing "mercapto-alkenyl" click chemical curing packaging materials, the primary purpose of the present invention is to provide a high-performance silicone electronic potting compound, which is both Contains acryloyloxy groups that can efficiently undergo "mercapto-alkenyl" photocuring, and contains olefin groups t

Method used

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  • High-performance organic silicon electronic pouring sealant and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0042] A preparation method for high-performance organosilicon electronic potting glue, comprising the following steps:

[0043] (1) Mix 30 parts of diphenyldichlorosilane, 10 parts of dimethyldichlorosilane, 20 parts of vinyltrichlorosilane and 20 parts of 3-(acryloyloxy)propyltrimethoxy Silane was mixed and dropped into 200 parts of toluene solvent, then slowly dropped into 60 parts of water, reacted at 140°C for 8 hours, and removed the solvent under reduced pressure to obtain a colorless and transparent acryloyloxyolefin-based organosilicon precursor oligomer A 1 .

[0044] (2) Mix 30 parts of phenyltrichlorosilane, 20 parts of dimethyldichlorosilane and 30 parts of 3-mercaptopropyltrimethoxysilane into 150 parts of toluene solvent by weight, and then slowly drop into 70 parts of water, reacted at 140°C for 8 hours, and removed the solvent under reduced pressure to obtain a colorless and transparent mercapto organosilicon precursor oligomer B 1 .

[0045] (3) 60 parts o...

Embodiment 2

[0048] A preparation method for high-performance organosilicon electronic potting glue, comprising the following steps:

[0049] (1) Mix 50 parts of phenyltrichlorosilane, 25 parts of methylvinyldichlorosilane and 15 parts of 3-(acryloyloxy)propyltriethoxysilane into 250 parts of toluene in proportion by weight Solvent, then slowly drop 80 parts of water, react at 130°C for 5 hours, remove the solvent under reduced pressure, and obtain a colorless and transparent acryloyloxy olefin-based organosilicon precursor oligomer A 2 .

[0050] (2) Mix 40 parts of diphenyldichlorosilane, 20 parts of dimethyldichlorosilane and 30 parts of 3-mercaptopropyltriethoxysilane into 200 parts of toluene solvent by weight, then slowly Drop in 90 parts of water, react at 120°C for 6 hours, remove the solvent under reduced pressure, and obtain a colorless and transparent mercapto organosilicon precursor oligomer B 2 .

[0051] (3) 50 parts of acryloxy olefin-based silicone precursor oligomer A ...

Embodiment 3

[0054] A preparation method for high-performance organosilicon electronic potting glue, comprising the following steps:

[0055] (1) Mix 40 parts of diphenylsilanediol, 50 parts of methylvinyldichlorosilane and 20 parts of 3-(methacryloyloxy)propylmethyldimethoxysilane in proportion by weight Add 20 parts of toluene solvent dropwise, add 5 parts of triethylamine, react at 80°C for 5 hours, remove the solvent under reduced pressure, and obtain a colorless and transparent acryloyloxyolefin-based organosilicon precursor oligomer A 3 .

[0056] (2) 40 parts of diphenylsilanediol and 50 parts of 3-mercaptopropylmethyldimethoxysilane were mixed and dropped into 30 parts of toluene solvent according to the proportion by weight, and 4 parts of triethylamine were added, at 90°C After reacting for 6 hours, the solvent was removed under reduced pressure to obtain a colorless and transparent mercapto organosilicon precursor oligomer B 3 .

[0057] (3) 50 parts of acryloxy olefin-based ...

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Abstract

The invention discloses high-performance organic silicon electronic pouring sealant and a preparation method and application thereof. The high-performance organic silicon electronic pouring sealant is manufactured in the following method: mixing alkylene silane, acyloxy silane and silane coupling agent, adding catalyst in the mixture, heating and condensing the mixture to obtain propylene acyloxyalkylene organosilicon precursor oligomer, mixing sulfydryl silane and silane coupling agent, adding catalyst in the mixture, heating and condensing the mixture to obtain sulfydryl organosilicon presoma oligomer, mixing the propylene acyloxy alkylene organosilicon precursor oligomer, the sulfydryl organosilicon precursor oligomer and an initiator and conducting heating and condensation on the mixture under ultraviolet to obtain high-performance organic silicon electronic pouring sealant. The preparation method adopts combination of two crosslinking technology of ultraviolet curing and thermocuring, introduces the propylene acyloxy and alkylene to the organic silicon sealant, the sealant can quickly generate sulfydryl-alkenyl click chemistry ultraviolet curing and can efficiently generate sulfydryl-alkenyl click chemistry ultraviolet curing, and light transmittance and mechanical performance of the materials are improved.

Description

technical field [0001] The invention relates to a filling material for electronic packaging, in particular to a high-performance organosilicon electronic potting glue and its preparation method and application. Background technique [0002] In the context of the current global energy shortage worries rising again, saving energy is an important issue we will face in the future. In the field of lighting, the application of LED lighting products is attracting the attention of the world. [0003] LED is a new type of green light source product, known as the fourth-generation lighting source or green light source, which has the characteristics of energy saving, environmental protection, long life, small size, etc., and can be widely used in various indications, displays, decorations, backlights, General lighting and urban night scenes and other fields. The LED industry began in the 1970s, and since the 1990s, it has risen rapidly and developed rapidly around the world. Some eco...

Claims

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Application Information

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IPC IPC(8): C08G81/00C09J183/04C09K3/10
Inventor 胡继文刘锋李伟侯成敏刘国军李银辉邹海良
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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