High-performance organic silicon electronic pouring sealant and preparation method and application thereof

Abstract

The invention discloses high-performance organic silicon electronic pouring sealant and a preparation method and application thereof. The high-performance organic silicon electronic pouring sealant is manufactured in the following method: mixing alkylene silane, acyloxy silane and silane coupling agent, adding catalyst in the mixture, heating and condensing the mixture to obtain propylene acyloxyalkylene organosilicon precursor oligomer, mixing sulfydryl silane and silane coupling agent, adding catalyst in the mixture, heating and condensing the mixture to obtain sulfydryl organosilicon presoma oligomer, mixing the propylene acyloxy alkylene organosilicon precursor oligomer, the sulfydryl organosilicon precursor oligomer and an initiator and conducting heating and condensation on the mixture under ultraviolet to obtain high-performance organic silicon electronic pouring sealant. The preparation method adopts combination of two crosslinking technology of ultraviolet curing and thermocuring, introduces the propylene acyloxy and alkylene to the organic silicon sealant, the sealant can quickly generate sulfydryl-alkenyl click chemistry ultraviolet curing and can efficiently generate sulfydryl-alkenyl click chemistry ultraviolet curing, and light transmittance and mechanical performance of the materials are improved.

Description

technical field [0001] The invention relates to a filling material for electronic packaging, in particular to a high-performance organosilicon electronic potting glue and its preparation method and application. Background technique [0002] In the context of the current global energy shortage worries rising again, saving energy is an important issue we will face in the future. In the field of lighting, the application of LED lighting products is attracting the attention of the world. [0003] LED is a new type of green light source product, known as the fourth-generation lighting source or green light source, which has the characteristics of energy saving, environmental protection, long life, small size, etc., and can be widely used in various indications, displays, decorations, backlights, General lighting and urban night scenes and other fields. The LED industry began in the 1970s, and since the 1990s, it has risen rapidly and developed rapidly around the world. Some eco...

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Problems solved by technology

[0017] In order to overcome the disadvantages of low light transmittance and poor mechanical properties of existing "mercapto-alkenyl" click chemical curing packaging materials, the primary purpose of the present invention is to provide a high-performance silicone electronic potting compound, which is both Contains acryloyloxy groups that can efficiently undergo "mercapto-alkenyl" photocuring, and contains olefin groups that can efficiently undergo "mercapto-alkenyl" thermal curing. It adopts two crosslinking technologies of ultraviolet curing and thermal curing. Combined, the potting glue first makes the electronic components rapid prototyping through ultraviolet irradiation, and then improves the crosslinking degree of the material through thermal curing, thereby improving the light transmittance and mechanical properties of the material

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