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Small-sized substrate integrated waveguide band-pass hybrid ring

A substrate-integrated waveguide and hybrid ring technology, applied in waveguide-type devices, electrical components, connection devices, etc., can solve the problems of complex system framework, large circuit area, large loss, etc., to reduce circuit area, compact layout, avoid The effect of wasting interior space

Inactive Publication Date: 2012-06-20
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, the system framework is more complicated, the required circuit area is larger, and the loss after the circuit cascading is larger

Method used

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  • Small-sized substrate integrated waveguide band-pass hybrid ring
  • Small-sized substrate integrated waveguide band-pass hybrid ring
  • Small-sized substrate integrated waveguide band-pass hybrid ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: as figure 1 , figure 2 , image 3 As shown, a substrate-integrated waveguide miniaturized bandpass hybrid ring includes a first metal copper clad layer 1, a dielectric layer 4, and a second metal copper clad layer 2 stacked sequentially from top to bottom, in order to form the hybrid ring of the present invention , the first metal copper clad layer 1 and the second metal copper clad layer 2 are processed through the printed circuit board manufacturing process to form the required metal pattern (circuit structure), and the parts in the pattern are divided by virtual dotted lines , punch holes in the dielectric layer 4 and perform surface metallization treatment on the holes to form metallized through holes 6, the first metal copper clad layer 1 includes the upper surface area 11 of the substrate integrated waveguide, and is located on the upper surface area 11 of the substrate integrated waveguide Four microstrip lines 12 on both sides and connected ther...

Embodiment 2

[0027] Embodiment 2: as Figure 4 , Figure 5 , Image 6 As shown, a substrate-integrated waveguide miniaturized bandpass hybrid ring includes a first metal copper clad layer 1, a dielectric layer 4, a second metal copper clad layer 2, a second dielectric layer 5, a The three metal copper clad layers 3 are formed by processing the first metal copper clad layer 1, the second metal copper clad layer 2 and the third metal copper clad layer 3 through the printed circuit board manufacturing process in order to form the hybrid ring of the present invention. The required metal pattern (circuit structure), each part of the pattern is divided by a virtual dotted line, the dielectric layer 4 and the second dielectric layer 5 are punched and the holes are subjected to surface metallization treatment to form a metallized through hole 6, The first metal copper clad layer 1 includes the upper surface area 11 of the substrate integrated waveguide, two microstrip lines 12 located on both si...

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Abstract

The invention relates to a small-sized substrate integrated waveguide band-pass hybrid ring, which comprises a first metal copper-clad layer, a medium layer and a second metal copper-clad layer sequentially stacked from top to bottom, wherein the first metal copper-clad layer comprises a substrate integrated waveguide upper surface area, four ways of microstrip lines located on two sides of the substrate integrated waveguide upper surface area, eight groups of coupling grooves located on two sides of the microstrip lines in the substrate integrated waveguide upper surface area, an S-shaped upper groove located in the substrate integrated waveguide upper surface area and three rows of horizontal metalized through holes and three rows of longitudinal metalized through holes which are all located on the substrate integrated waveguide upper surface area. The metalized through holes penetrate through the substrate integrated waveguide upper surface area and the medium layer to be connected with the second metal copper-clad layer so as to respectively form a first resonant cavity, a second resonant cavity, a third resonant cavity and a fourth resonant cavity. The small-sized substrate integrated waveguide band-pass hybrid ring has the advantages of avoiding the problem of waste of the interior space of the existing hybrid ring, and being capable of greatly reducing the circuit area of the traditional hybrid ring.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave passive devices, in particular to a hybrid ring in microwave and millimeter wave passive devices. Background technique [0002] The development of wireless mobile communication technology requires microwave and millimeter wave circuits to compress the circuit area as much as possible while ensuring electrical performance, that is, miniaturization. On the one hand, with the advancement of semiconductor technology, active circuits in wireless communication systems have been miniaturized and can be effectively integrated using modern packaging technologies; on the other hand, antennas, filters, couplers, hybrid rings, etc. The source circuit still faces the key technical difficulty of miniaturization. [0003] The hybrid ring is a key component of microwave and millimeter wave subsystems and is widely used in microwave and millimeter wave circuits. The hybrid ring is a four-po...

Claims

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Application Information

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IPC IPC(8): H01P5/12H01P5/18H01P1/20
Inventor 程钰间樊勇
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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