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Single-component anaerobic adhesive with high filing gap and preparation method thereof

A single-component, anaerobic adhesive technology, applied in the field of anaerobic adhesives, can solve the problems of unable to form a seal, poor, can only use other fastening methods, poor curing effect of anaerobic adhesives, etc., to achieve good versatility and storage The effect of excellent stability

Active Publication Date: 2012-06-27
HUBEI HUITIAN NEW MATERIALS STOCK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As we all know, the curing of anaerobic adhesives is greatly affected by the gap. Generally speaking, if the gap exceeds 0.5mm, the curing effect of anaerobic adhesives will be poor, or even impossible to cure. It is this shortcoming that makes the application of anaerobic adhesives difficult. has been greatly restricted
For example, when using anaerobic adhesive to lock or seal large-diameter coarse thread bolts or pipe threads, the effect is often poor, and other fastening methods can only be used for anti-loosening; some flanges and cylinder head ends have deep grooves If the gap exceeds 1mm, the anaerobic plane sealant cannot be cured and cannot form an effective seal, so rubber gaskets have to be used; although this problem can sometimes be improved by spraying an anaerobic accelerator primer, but using a primer It not only increases the process, but also increases the cost, and cannot reflect the advantages of anaerobic adhesives

Method used

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  • Single-component anaerobic adhesive with high filing gap and preparation method thereof
  • Single-component anaerobic adhesive with high filing gap and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Proportion

[0034] Polyethylene glycol 200 dimethacrylate (molecular weight 336) 96.26% Wt

[0035] 1,4-Naphthoquinone 0.02%Wt

[0036] N-Acetophenylhydrazine 1.7%Wt

[0037] 0.5% Wt O-sulfonyl benzimide

[0038] EDTA Tetrasodium Salt 0.02%Wt

[0039] Cumene Hydroperoxide 1.5%Wt

[0040] Preparation:

[0041] 1) Add polyethylene glycol 200 dimethacrylate, 1,4-naphthoquinone, N-acetylphenylhydrazine, o-sulfonyl benzimide to the container, stir at 5°C~35°C for 30mim~90min, Until the solid material is completely dissolved evenly;

[0042] 2) Add EDTA tetrasodium salt, stir at 5°C~35°C for 30mim~90min until uniform;

[0043] 3) Add cumene hydroperoxide and stir at 5°C~35°C for 20mim~30min until uniform;

[0044] 4) Discharge, fill in low-density polyethylene packaging, store away from light, and wait for use.

[0045] Performance Testing:

[0046] 1. Stability: heat the one-component anaerobic structural adhesive in an oven at 80°C, and measure the time when the ...

Embodiment 2

[0055] Proportion:

[0056] Polyethylene glycol 400 dimethacrylate (molecular weight 536) 91.43% Wt

[0057]1,4-Naphthoquinone 0.05%Wt

[0058] N-Acetophenylhydrazine 1.50%Wt

[0059] O-sulfonyl benzimide 3.00%Wt

[0060] EDTA Tetrasodium Salt 0.02%Wt

[0061] Cumene Hydroperoxide 2.00%Wt

[0062] Fumed silica 2.00%Wt

[0063] Preparation:

[0064] 1) Add polyethylene glycol 400 dimethacrylate, 1,4-naphthoquinone, N-acetylphenylhydrazine, o-sulfonyl benzimide to the container, stir at 5°C~35°C for 30mim~90min, Until the solid material is completely dissolved evenly;

[0065] 2) Add EDTA tetrasodium salt, stir at 5°C~35°C for 30mim~90min until uniform;

[0066] 3) Add cumene hydroperoxide and fumed silica and stir at 5°C~35°C for 20mim~30min until uniform;

[0067] 4) Discharge, fill in low-density polyethylene packaging, store away from light, and wait for use.

[0068] The performance test is the same as in Example 1.

[0069] The test results are shown in Table 1....

Embodiment 3

[0071] Proportion:

[0072] Triethylene glycol dimethacrylate (molecular weight 286) 80.45% Wt

[0073] Hydroxyethyl Methacrylate 15%Wt

[0074] 1,4-Naphthoquinone 0.03%Wt

[0075] N-Acetophenylhydrazine 1.00%Wt

[0076] 2.00% Wt O-sulfonyl benzimide

[0077] EDTA Tetrasodium Salt 0.02%Wt

[0078] Cumene Hydroperoxide 1.50%Wt

[0079] Preparation:

[0080] 1) Add triethylene glycol dimethacrylate, hydroxyethyl methacrylate, 1,4-naphthoquinone, N-acetylphenylhydrazine, and o-sulfonyl benzimide in the container, at 5 ° C ~ Stir at 35°C for 30mim~90min until the solid material is completely dissolved and uniform;

[0081] 2) Add EDTA tetrasodium salt, stir at 5°C~35°C for 30mim~90min until uniform;

[0082] 3) Add cumene hydroperoxide and stir at 5°C~35°C for 20mim~30min until uniform;

[0083] 4) Discharge, fill in low-density polyethylene packaging, store away from light, and wait for use.

[0084] The performance test is the same as in Example 1.

[0085] The test r...

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Abstract

The invention relates to a single-component anaerobic adhesive with high filing gap and a preparation method thereof, and belongs to the technical field of anaerobic adhesives. Due to the great influence of gap on the curing of a present anaerobic adhesive, its curing effect is very poor when the gap exceeds 0.5mm and even the present anaerobic adhesive can not be cured. The above problem of the present anaerobic adhesive is solved in the invention. The anaerobic adhesive provided by the invention is mainly characterized by comprising: (A) 50-98 wt% of a terminated unsaturated monomer containing at least one vinyl with the molecular weight being less than 600; (B) 0-30 wt% of a plasticizer; (C) 0-20 wt% of a powder; (D) 0.02-1 wt% of a polymerization inhibitor; (E) 1-3 wt% of N-acetylphenylhydrazine; (F) 0.5-5 wt% of benzoyl sulfonic imide; (G) 0.01-0.1% of a metal ion chelating agent; (H) 0.1-5% of a peroxide initiator; and (I) 0-20% of fumed silica. The filling gap in the invention can reach more than 5mm. The anaerobic adhesive has excellent storage stability. Failure moment and average dismounting moment can be adjusted within 0.1-30N.m. sealing performance can reach 1MPa (air pressure) without leakage. Static shearing strength can reach more than 25 MPa. The invention mainly provides the single-component anaerobic adhesive with high filing gap and the preparation method thereof.

Description

technical field [0001] The invention belongs to the technical field of anaerobic adhesives, and specifically relates to a single-component high-gap anaerobic adhesive, which can be anaerobically cured and is widely used in thread locking, pipe thread sealing, and plane sealing in industries such as automobiles, engineering machinery, and electronic appliances. Sealing, part retention. Background technique [0002] As we all know, the curing of anaerobic adhesives is greatly affected by the gap. Generally speaking, if the gap exceeds 0.5mm, the curing effect of anaerobic adhesives will be poor, or even impossible to cure. It is this shortcoming that makes the application of anaerobic adhesives difficult. has been greatly restricted. For example, when using anaerobic adhesive to lock or seal large-diameter coarse thread bolts or pipe threads, the effect is often poor, and other fastening methods can only be used for anti-loosening; some flanges and cylinder head ends have...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J11/04C09J11/06C09K3/10
Inventor 艾少华韩胜利赵景左章锋
Owner HUBEI HUITIAN NEW MATERIALS STOCK CO LTD
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