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Method for disassembling micro-electro-mechanical devices under assistance of laser impact

A technology of laser shock and electrical devices, which is applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of difficult disassembly, scratch damage of devices, etc., and achieve the effect of avoiding contact scratches

Inactive Publication Date: 2012-07-04
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the problem that the traditional operating process in the disassembly process of micro-electromechanical devices is easy to cause scratch damage to the device and difficult to disassemble at the micro-nano scale, the present invention proposes a laser shock wave-assisted disassembly method for micro-electromechanical devices

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  • Method for disassembling micro-electro-mechanical devices under assistance of laser impact
  • Method for disassembling micro-electro-mechanical devices under assistance of laser impact
  • Method for disassembling micro-electro-mechanical devices under assistance of laser impact

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Embodiment Construction

[0034] The details and working conditions of the specific device proposed by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0035] The MEMS device I2 is attached to the MEMS carrier wafer 4 , and the MEMS device II3 is interference-connected with the MEMS device I2 to form the MEMS 1 .

[0036] Wash the surface of the MEMS device I2 and the MEMS device II3 with alcohol or acetone, pre-coat the absorbing layer 5 on the back of the MEMS device I2 and the MEMS device II3, the thickness of the absorbing layer 5 is 0.1-0.15 mm, and there is enough viscosity to make The MEMS 1 will not fall off from the surface of the metallic glass 6; the MEMS 1 is adhered to the surface of the high-strength metallic glass 6 by using the viscosity of the absorbing layer 5, and the metallic glass 6 serves as the carrier for the MEMS 1 and the constraints of the laser shock layer; the metallic glass 6 carrying the micro-electro-mechanical syst...

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Abstract

The invention relates to a method for disassembling micro-electro-mechanical devices, in particular to separation of matched micro-electro-mechanical devices by using a mechanical effect of expansion and impact waves of plasmas produced by laser impact, and is suitable for disassembly and separation of the micro-electro-mechanical devices. The micro-electro-mechanical devices inside a micro-electro-mechanical system are disassembled through a non-contact force generated by an impact wave by utilizing the mechanical effect of the laser impact wave, so that the problems that contact scratches and damages of conventional operation to parts, and the parts are difficult to disassemble under a micro nano scale are solved; the micro-electro-mechanical devices are popped out by fully using the impact pressure of the laser impact wave in a laser radiation direction; and the method is a brand new method for disassembling the micro-electro-mechanical devices.

Description

technical field [0001] The invention relates to a disassembly method of micro-electromechanical devices, in particular to a method for separating mated micro-electro-mechanical devices by utilizing the expansion of plasma generated by laser shock and the mechanical effect of shock waves, and is suitable for disassembly and separation of micro-electro-mechanical devices. . Background technique [0002] MEMS has the characteristics of miniaturization, diversification, and microelectronics, and has advantages that traditional electromechanical systems cannot match. According to the size of the shape, MEMS can be divided into: 1-10mm micro machinery, 1μm-1mm micro Mechanics and 1nm-1μm nanomachines; at the scale that current microelectromechanical systems can achieve, the basic laws of the macroscopic physical world are still in effect, but with the continuous shrinking of devices or structures, the integration level is getting higher and higher, and the macroscopic Interferenc...

Claims

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Application Information

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IPC IPC(8): B23P11/00B81C1/00
Inventor 鲁金忠钟金杉罗开玉张磊王庆伟戴峰泽齐晗罗密
Owner JIANGSU UNIV
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