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Method for preparing epoxy resin composite material through SMC process

A technology of epoxy resin and composite materials, which is applied in the field of epoxy resin composite materials prepared by SMC technology, to achieve the effects of improved insulation effect, lower curing temperature and low shrinkage

Active Publication Date: 2014-02-26
江西固康新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its molding process usually includes: hand lay-up molding, compression molding, injection molding, RTM molding, etc., and the preparation method of epoxy resin-based composite materials prepared by SMC technology has not been reported yet.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Step 1: Preparation of paste resin: take epoxy resin as the matrix material of the composite material, weigh E-51 epoxy resin, micronized dicyandiamide curing agent and silane coupling agent KH-550 respectively, and the mass ratio is 100 :10:1, after stirring well, add 10% of the mass of E-51 epoxy resin as a filler, knead until it is dough-like, so that it is not sticky, and set aside;

[0015] Step 2: Sheet pressing: Place the mixture kneaded in step 1 between two layers of high modulus glass fiber cloth as reinforcement, and cover both sides with two layers of high modulus glass fiber cloth and polyester film , placed in the center of the pressure molding machine, and pressed into a sheet molding compound sample under a pressure of 75MPa;

[0016] Step 3: Curing molding: The sheet molding compound sample prepared in step 2 was cured on a vulcanization molding machine to form a composite material plate. The curing process was as follows: the temperature was 160° C., t...

Embodiment 2

[0018] Step 1: Preparation of paste resin: take epoxy resin as the matrix material of the composite material, weigh E-44 epoxy resin, micronized dicyandiamide curing agent and silane coupling agent KH-550 respectively, and the mass ratio is 100 :10:1, after stirring well, add 10% of the mass of E-51 epoxy resin as a filler, knead until it is dough-like, so that it is not sticky, and set aside;

[0019] Step 2: Sheet pressing: Place the mixture kneaded in step 1 between two layers of high modulus glass fiber cloth as reinforcement, and cover both sides with two layers of high modulus glass fiber cloth and polyester film , placed in the center of the pressure molding machine, and pressed into a sheet molding compound sample under a pressure of 75MPa;

[0020] Step 3: Curing molding: The sheet molding compound sample prepared in step 2 was cured on a vulcanization molding machine to form a composite material plate. The curing process was as follows: the temperature was 160° C., t...

Embodiment 3

[0022] Step 1: Preparation of paste resin: take epoxy resin as the matrix material of the composite material, weigh E-42 epoxy resin, micronized dicyandiamide curing agent and silane coupling agent KH-550 respectively, and the mass ratio is 100 :10:1, after stirring well, add 10% of the mass of E-51 epoxy resin as a filler, knead until it is dough-like, so that it is not sticky, and set aside;

[0023] Step 2: Sheet pressing: Place the mixture kneaded in step 1 between two layers of high modulus glass fiber cloth as reinforcement, and cover both sides with two layers of high modulus glass fiber cloth and polyester film , placed in the center of the pressure molding machine, and pressed into a sheet molding compound sample under a pressure of 75MPa;

[0024] Step 3: Curing molding: The sheet molding compound sample prepared in step 2 was cured on a vulcanization molding machine to form a composite material plate. The curing process was as follows: the temperature was 160° C., t...

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PUM

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Abstract

A method for preparing an epoxy resin composite material through an SMC process comprises marks of E-51, E-44, E-42, E-20, E-12 and the like. Epoxy resin serves as a substrate, glass fiber serves as a strengthening body, subtle pulverization dicyandiamide serves as a curing agent, a silane coupling agent KH-550 serves as a coupling agent, and white carbon black serves as a filler. The preparation process comprises preparation of paste resin, sheet pressing and solidification molding. The method has the advantages that (1) the method is low in contractibility and capable of effectively overcoming the shortcoming of unsaturated polyester resin in the SMC; (2) the problem that products cannot be stored for long time is solved, dicyandiamide powder can be made into micro powder grade (D50=2.5mum), intermiscibility with epoxy resin is improved, solidification temperature of a solidified system is reduced, and solidification reaction speed is improved to some extent; and (3) the method can achieve batch production of materials of different size and thickness, thereby being wide in purpose.

Description

technical field [0001] The invention relates to a method for preparing an epoxy resin composite material, in particular to a method for preparing an epoxy resin composite material with an SMC process. Background technique [0002] SMC is the abbreviation of "Sheet Molding Compound" in English, which is a sandwich molding material. When using, just remove the film on both sides, cut according to the size of the required product, put the laminated layers into the heated mold to heat and press, and the desired product can be obtained. The SMC method is an advanced molding method for composite materials. The molding compound made by this method is cheap, easy to use, and has good process performance. It can be used to press products with different specifications and complex shapes. The key technologies for preparing SMC are: (1) The selection of resin. Although the commonly used unsaturated polyester resin has excellent mechanical properties, electrical properties and chemical...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/04C08K3/04C08K7/14C08G59/50B29C43/02B29C35/02
Inventor 朱正吼李小敏
Owner 江西固康新材料有限公司
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