Organic silicon heat radiation material and preparation method thereof

A heat dissipation material, silicone technology, applied in the field of thermal materials, can solve problems such as shortening device life and affecting product life, and achieve good operability

Inactive Publication Date: 2012-07-04
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These components continue to accumulate heat during long-term use. If the generated heat cannot be dissipat

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0010] Example 1

[0011] Calculated by the weight of simethicone 100 as the unit

[0012] Add 100 parts of dimethyl silicone oil, 400 parts of aluminum oxide, 80 parts of aluminum nitride, 100 parts of aluminum hydroxide, and 20 parts of melamine to a stirred tank and stir for 4 hours at 100-120°C, vacuum, and rotate at 300 rpm . Cool to room temperature, add 5 parts of fumed silica and 2 parts of wetting agent after uniformly stirring, and stir for 30 minutes at a speed of 600 rpm; a paste is obtained.

Example Embodiment

[0013] Example 2

[0014] Calculated by the weight of simethicone 100 as the unit

[0015] Add 100 parts of dimethyl silicone oil, 525 parts of aluminum oxide, 100 parts of aluminum nitride, 100 parts of aluminum hydroxide, and 25 parts of melamine into a stirred tank. Stir at 100~120℃ for 4 hours, stir for 2 hours and then vacuum , The speed is 500rpm. Cool to room temperature, add 10 parts of fumed silica and 7 parts of wetting agent after uniformly stirring, and stir for 30 minutes at a speed of 1000 rpm; a paste is obtained.

Example Embodiment

[0016] Example 3

[0017] Calculated by the weight of simethicone 100 as the unit

[0018] Add 100 parts of dimethyl silicone oil, 650 parts of aluminum oxide, 122 parts of aluminum nitride, 108 parts of aluminum hydroxide, and 40 parts of melamine to a stirred tank and stir for 4 hours at 100-120°C, vacuum, and rotate at 400rpm . Cool to room temperature, add 15 parts of fumed silica and 10 parts of wetting agent after uniformly stirring, and stir for 30 minutes at 700 rpm to obtain a paste.

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PUM

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Abstract

The invention relates to a paste organic silicon heat radiation material and a preparation method of the paste organic silicon heat radiation material. The heat radiation material comprises the following ingredients in parts by weight: 100 parts of simethicone, 2 to 10 parts of wetting agents, 5 to 15 parts of gas-phase silicon dioxide, 400 to 700 parts of alumina, 100 to 120 parts of aluminium hydroxide, 20 to 40 parts of melamine and 80 to 120 parts of aluminum nitride. The on-site operation is realized, the operability and the plasticity are good, and in addition, the hand sticking is avoided.

Description

technical field [0001] The invention relates to a thermal material, in particular to a paste-like organic silicon heat dissipation material used for filling between an electronic component and a heat sink. Background technique [0002] With the widespread application of high-power electronic components, heat dissipation has increasingly become an important factor affecting product life. These components continue to accumulate heat during long-term use. If the generated heat cannot be exported in time, the life of these devices will be greatly shortened, thereby affecting the life of the product. Paste heat dissipation materials have good wettability, small thermal resistance, good heat dissipation effect, and are easy to use. They are more and more used in heat-generating devices and heat-dissipating devices. [0003] In some applications, on-site construction requires good operability, the product is not sticky, and good plasticity is also required. Contents of the inv...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K13/02C08K3/22C08K3/28C08K5/3492C08K3/36C08K5/5435C09K5/14
Inventor 王红玉王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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