Organic silicon heat radiation material and preparation method thereof

Abstract

The invention relates to a paste organic silicon heat radiation material and a preparation method of the paste organic silicon heat radiation material. The heat radiation material comprises the following ingredients in parts by weight: 100 parts of simethicone, 2 to 10 parts of wetting agents, 5 to 15 parts of gas-phase silicon dioxide, 400 to 700 parts of alumina, 100 to 120 parts of aluminium hydroxide, 20 to 40 parts of melamine and 80 to 120 parts of aluminum nitride. The on-site operation is realized, the operability and the plasticity are good, and in addition, the hand sticking is avoided.

Description

technical field [0001] The invention relates to a thermal material, in particular to a paste-like organic silicon heat dissipation material used for filling between an electronic component and a heat sink. Background technique [0002] With the widespread application of high-power electronic components, heat dissipation has increasingly become an important factor affecting product life. These components continue to accumulate heat during long-term use. If the generated heat cannot be exported in time, the life of these devices will be greatly shortened, thereby affecting the life of the product. Paste heat dissipation materials have good wettability, small thermal resistance, good heat dissipation effect, and are easy to use. They are more and more used in heat-generating devices and heat-dissipating devices. [0003] In some applications, on-site construction requires good operability, the product is not sticky, and good plasticity is also required. Contents of the inv...

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Problems solved by technology

These components continue to accumulate heat during long-term use. If the generated heat cannot be dissipated in time, the life of these devices will be greatly shortened, thereby affecting the life of the product.