Copper alloy

Abstract

A copper alloy containing Ni: 1.5% - 3.6% and Si: 0.3% - 1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 [mu]m; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

Description

technical field [0001] The present invention relates to a copper alloy having good electrical conductivity, high strength, excellent bending workability, and excellent stress relaxation resistance, and in particular to a connector and lead frame suitable for constituting electric and electronic parts Copper alloys for electrical and electronic parts such as relays, switches, etc. Background technique [0002] Copper alloy materials used for electrical and electronic components such as connectors, lead frames, relays, switches, etc., are required to have good electrical conductivity in order to suppress Joule heat generated by electrical and electronic components, and to withstand electrical and electronic components as much as possible. High strength of stress imparted during assembly or work. In addition, electric and electronic parts are generally formed by bending, and materials for the bent electric and electronic parts are also required to have excellent bending workab...

AI Technical Summary

Problems solved by technology

The copper alloy sheet disclosed in Patent Document 1 is a Corson alloy containing 2.0 to 6.0% by mass of Ni, and the average grain size of a Corson alloy of Si in the range of 4 to 5 in terms of the mass ratio of Ni / Si is set to 10 μm. Below, and according to the measurement results of the SEM-EBSP method, there is an aggregate structure with a ratio of Cube orientation {001} of 50% or more, and there is no structure observed by observation of the structure with a 300-magnification optical microscope layered boundary

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