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Chemical copper-plating solution and chemical copper-plating method

A technology of electroless copper plating and copper salt, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of difficult to obtain and thick copper plating, and achieve the effect of increasing the maximum thickness

Active Publication Date: 2012-07-04
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The present invention aims to solve the problem in the prior art that it is difficult to obtain a thicker copper coating in an electroless copper plating solution in which sodium hypophosphite is a reducing agent

Method used

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  • Chemical copper-plating solution and chemical copper-plating method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The specific content of electroless copper plating solution A1 is as follows:

[0037] Copper sulfate pentahydrate 7g / L

[0038] Triethanolamine 12g / L

[0039] NaOH 8g / L

[0040] 2-aminopyridine 0.002g / L

[0041]Sodium citrate 10g / L

[0042] Nickel sulfate 0.6g / L

[0043] Sodium hypophosphite 32g / L

[0044] 4-cyanopyridine 0.003g / L.

Embodiment 2

[0046] The difference with Example 1 is that the electroless copper plating solution also contains stabilizer potassium ferrocyanide, complexing agent ethylenediamine, and the specific content is

[0047] Potassium ferrocyanide 0.005g / L

[0048] Ethylenediamine 1.5g / L,

[0049] Obtain electroless copper plating solution A2.

Embodiment 3

[0051] The difference with embodiment 2 is that surfactant sodium dodecylbenzenesulfonate is also contained in the electroless copper plating solution, accelerator ammonium chloride, and concrete content is:

[0052] Sodium dodecylbenzenesulfonate 0.003g / L,

[0053] Ammonium chloride 1g / L,

[0054] Obtain electroless copper plating solution A3.

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Abstract

The invention provides chemical copper-plating solution and a chemical copper-plating method. The chemical copper-plating solution comprises copper salt, nickel salt, sodium monophosphate, a complexing agent, a stabilizing agent and water solution of a potential of hydrogen (pH) conditioning agent. The stabilizing agent contains 2-aminopyridine and 4 cyanopyridine. The complexing agent comprises triethanolamine and citrate, the content ratio of the triethanolamine to the citrate is 1:1-5:1, and the pH value of the chemical copper-plating solution is 8-11. By adopting the chemical copper-plating solution with the sodium monophosphate serving as a reducing agent, the thickness of a plating layer can reach 3-7 micrometers, so that the largest thickness of a traditional technology is greatly improved.

Description

technical field [0001] The invention relates to the field of non-metallic electroless plating, in particular to an electroless plating solution and an electroless copper plating method. Background technique [0002] Since the birth of electroless copper plating technology, scientists have continuously explored the kinetic process of its heterogeneous surface catalytic deposition; trying to make a reasonable explanation for the experimental facts of electroless copper plating. At present, most commercial electroless copper plating solutions use formaldehyde as a reducing agent, and there are two basic chemical reactions in the reaction process, namely: [0003] Reaction formula 1: Cu 2+ +2e→Cu [0004] Reaction 2: 2HCHO+4OH-→H 2 ↑+2H 2 O+2HCOO-+2e [0005] The chemical reaction takes place on the catalytic heterogeneous surface in the absence of external power and electrons. [0006] Above-mentioned reaction formula one and reaction formula two can be combined into the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
Inventor 韦家亮林宏业连俊兰
Owner BYD CO LTD
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