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LED (light-emitting diode) bulb lamp

A technology of LED bulb lamps and lamp cups, applied in lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve problems such as cumbersome processing technology, shorten service life, and early light decay, and achieve low manufacturing costs, Prevention of wrong assembly, good heat dissipation effect

Inactive Publication Date: 2012-07-04
KUSN YOUDE PHOTOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) General plastics: Plastic injection molding process is used, but the heat dissipation effect of general plastic materials is extremely poor;
[0004] (2) Thermally conductive plastic: using plastic injection molding process, the heat dissipation effect of thermally conductive plastic is slightly better than that of ordinary plastic materials. However, the product development of thermally conductive plastic in the market has not yet been diversified, so this material is still a high-priced material;
Due to the cumbersome processing technology and indirectly increased costs, the unit price of the product is relatively high; only a few aluminum materials suitable for die-casting are available in the market; The surface needs to be painted or electroplated to greatly reduce the heat dissipation effect;
[0006] (4) Aluminum profile: use aluminum extrusion or aluminum pumping process, the material of aluminum profile must undergo secondary post-processing procedures, and use milling process to process it into the shape effect required by the market, so the unit price of aluminum profile products is high, so that Increased manufacturing costs
[0007] Due to the limited internal space of the lamp, if the high heat generated by the LED light cannot be effectively exported to the outside for heat dissipation, the heat energy will be accumulated inside the product, resulting in a decrease in the lumens of the LED light source, premature light decay or shortened service life, etc.
[0008] According to the above description, it can be seen that materials that are cheap, fast and easy to use, such as general plastics and heat-conducting plastics, are only suitable for low-wattage lamps; on the contrary, metal materials with good heat conductivity, such as aluminum alloy and aluminum profiles , but the high unit price due to too many manufacturing processes and slow manufacturing speed makes it difficult for the lamps manufactured with it to meet the needs of consumers

Method used

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  • LED (light-emitting diode) bulb lamp
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  • LED (light-emitting diode) bulb lamp

Examples

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Embodiment Construction

[0036] The specific implementation manner of the LED bulb lamp of the present invention will be described below with reference to the accompanying drawings.

[0037] Embodiments of the present invention are described with reference to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "side", etc., are only referring to the directions of the attached drawings . These directional terms are used to illustrate and understand the present invention, but not to limit the present invention. In the following embodiments, the same parts are denoted by the same symbols in different drawings.

[0038] refer to figure 1 . An LED bulb lamp includes a base 10 and a lampshade 30 installed at both ends of a lamp cup 20 . The lamp cup 20 has a circuit board 60 inside, and the circuit board 60 includes a power board ...

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PUM

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Abstract

The invention discloses an LED (light-emitting diode) bulb lamp. The LED bulb lamp comprises a base and a lamp cover which are arranged at the two ends of a lamp cup, wherein a circuit board is arranged at the inner part of the lamp cup; the circuit board comprises a power board and a lamp plate which are connected by a heat storage flat plate; a bracket is also arranged at the inner part of the lamp cup; the bracket extends along the inner wall of the lamp cup and contains the circuit board; the bracket comprises a plurality of T-shaped support frames connected by an annular framework; the annular framework is provided with a plurality of locating columns; the top of the lamp cup is provided with a pressing plate; and the pressing plate is provided with a plurality of locating holes matched with the locating columns.

Description

technical field [0001] The invention relates to the technical field of LED lighting fixtures, in particular to an LED bulb lamp. Background technique [0002] Regarding the materials and processing technology of LED bulb lamps, the current methods used in the lighting industry are as follows: [0003] (1) General plastics: Plastic injection molding process is used, but the heat dissipation effect of general plastic materials is extremely poor; [0004] (2) Thermally conductive plastic: using plastic injection molding process, the heat dissipation effect of thermally conductive plastic is slightly better than that of ordinary plastic materials. However, the product development of thermally conductive plastic in the market has not yet been diversified, so this material is still a high-priced material; [0005] (3) Aluminum alloy: using die-casting technology, the aluminum alloy material must go through various post-processing procedures before it can be accepted by the market...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V17/16F21Y101/02F21K9/232F21V29/508F21Y105/18F21Y115/10
Inventor 朱宥华
Owner KUSN YOUDE PHOTOELECTRIC TECH
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