Surface plasmon resonance rectenna and preparation method therefor

A technology of surface plasmon and rectenna, which is applied in the direction of surface reaction electrolytic coating, electrolytic coating, coating, etc., can solve the problems of high technical cost, unsuitable for large-scale, industrial production, etc., to improve transmission efficiency and reduce loss , the effect of increasing the effective area

Inactive Publication Date: 2012-07-04
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] In order to overcome the high technical cost existing in the prior art and not being suitable for large-scale and industrialized production, the present invention proposes a surface plasmon resonance rectenna and its preparation method

Method used

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  • Surface plasmon resonance rectenna and preparation method therefor
  • Surface plasmon resonance rectenna and preparation method therefor
  • Surface plasmon resonance rectenna and preparation method therefor

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Embodiment 1

[0038] This embodiment is a surface plasmon resonance rectenna. The surface plasmon resonance rectenna is Ti / TiO 2 NT / Cu structure, specifically, the surface plasmon resonance rectenna has three layers, the lower layer is metal Ti, and TiO is oxidized on one surface of metal Ti 2 nanotube array layer, the TiO 2 A Cu nanoparticle metal layer is deposited on the surface of the nanotube array layer. The TiO in the middle of the surface plasmon resonance rectenna 2 The nanotube array layer is a heterogeneous layer. The TiO 2 The inner pore diameter of the nanotube array is 100±10 nm, and the tube length is 2.2±0.2 μm. The photodeposition process was irradiated with 1% power for 10 minutes. The product size is Φ5mm and the color is gray.

[0039] The microscopic surface morphology of the Cu nanoparticle metal layer is nanoparticles, the particle size is 50-80nm, no specific shape, attached to the TiO 2 On the tube wall on the surface of the nanotube substrate, a small amoun...

Embodiment 2

[0049] This embodiment is a surface plasmon resonance rectenna. The surface plasmon resonance rectenna is Ti / TiO 2 NT / Cu structure, specifically, the surface plasmon resonance rectenna has three layers, the lower layer is metal Ti, and TiO is oxidized on one surface of metal Ti 2 nanotube array layer, the TiO 2 A Cu nanoparticle metal layer is deposited on the surface of the nanotube array layer. The TiO in the middle of the surface plasmon resonance rectenna 2 The nanotube array layer is a heterogeneous layer. The TiO 2 The inner pore diameter of the nanotube array is 100±10 nm, and the tube length is 2.2±0.2 μm. The photodeposition process was irradiated with 1% power for 20min. The product size is Φ5mm, and the color is gray-green.

[0050] The microscopic surface morphology of the Cu nanoparticle metal layer is nanoparticles, and its particle size is 100-150nm, without a specific shape, and its distribution density becomes larger, and it adheres to the TiO 2 On the...

Embodiment 3

[0060] This embodiment is a surface plasmon resonance rectenna. The surface plasmon resonance rectenna is Ti / TiO 2 NT / Cu structure, specifically, the surface plasmon resonance rectenna has three layers, the lower layer is metal Ti, and TiO is oxidized on one surface of metal Ti 2 nanotube array layer, the TiO 2 A Cu nanoparticle metal layer is deposited on the surface of the nanotube array layer. The TiO in the middle of the surface plasmon resonance rectenna 2 The nanotube array layer is a heterogeneous layer. The TiO 2 The inner pore diameter of the nanotube array is 100±10 nm, and the tube length is 2.2±0.2 μm. The photodeposition process was irradiated with 1% power for 40min. The product size is Φ5mm, and the color is light dark red.

[0061] The microscopic surface morphology of this embodiment is Cu nanorods with different growth directions, the length is between 300nm and 650nm, and the width is basically constant, which is 110±5nm. There are a small amount of ...

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Abstract

The invention provides a surface plasmon resonance rectenna and a preparation method therefor. The surface plasma resonance rectenna adopts a three-layer structure, wherein the lower layer is made from metal Ti; a TiO2 nanotube array layer is generated on one surface of the metal Ti in an oxidation manner; a Cu nano particle metal layer is arranged on the surface of the TiO2 nanotube array layer through photodeposition; and the micro-surface appearance of the Cu nano particle metal layer is nano particles. In the invention, as photodeposition replaces ultrahigh vacuum electron beam evaporation technology, and inexpensive metal copper Cu replaces precious metal Au to prepare the rectenna adopting the Ti/TiO2NT/Cu structure, the difficult problem that the conventional metal layer can not be used in large-scale industrial production due to high cost in deposition technology, equipment investment and precious metal, and green low-cost development of solar energy technology is facilitated.

Description

technical field [0001] The invention relates to the field of optical rectennas, in particular to a metal-insulator-metal MIM structure used as a rectenna, which can convert solar energy into direct current. Background technique [0002] The devices that convert electromagnetic radiation such as sunlight into electrical energy mainly include photovoltaic cells, rectennas and thermal devices. Rectennas have a conversion rate of 90% in the 2.45GHz band due to their low cost, simple structure, and metal-insulator-metal diode structure rectifiers. Efficiency, therefore, is a promising technology for light-to-energy conversion. [0003] The working principle of the rectenna is that the upper metal and the insulating layer form a Schottky contact, the incident photons interact with the metal particles to form a surface plasmon resonance of free electrons, and the surface plasmon resonance is converted into a charge density wave, causing the potential change of the metal electrode, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/07H01L31/0224H01L31/18C25D11/26C25D3/38
CPCY02E10/50H01L31/1085H01L31/035209
Inventor 陈福义刘建
Owner NORTHWESTERN POLYTECHNICAL UNIV
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